Industry Directory | Consultant / Service Provider
Knack Systems is a Premium Partner of SAP with a focus around Customer Management which includes Cloud Solutions, Hybrid Solutions, E-commerce and Analytics.
Recruiter for IC ATE Test Engineers and SAP Functional and Technical Consultants / Permanent Placement
New Equipment | Cleaning Equipment
The Atmospheric Pressure Plasma (AP Plasma) designed by professional engineers in an eco-friendly environment to completely remove any kind of organic pollutants. The unique design features and certified R&D patterns will increase surface bounding tr
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New Equipment | Education/Training
The Atmospheric Pressure Plasma (AP Plasma) designed by professional engineers in an eco-friendly environment to completely remove any kind of organic pollutants. Application Academic and Industrial Research Laboratory Photoelectric eleme
Electronics Forum | Mon Aug 30 14:56:07 EDT 2010 | davef
Search the fine SMTnet Archives for background discussions on Manex, DBA, Catalyst, SAP in a box ...
Electronics Forum | Tue Feb 28 06:55:44 EST 2006 | Rob
Hi I've used the following: SAP Connect & Go (or SAP in a box - designed for smaller companies)- despite the description a LOT of set up work, but not bad once you get the hang of it. Costs lots to change things though. Tetra CS3 - YUK! MFG Pro -
Used SMT Equipment | In-Circuit Testers
Philips PM5418TDS Philips/Fluke PM5418TDS TV Signal Generator The PM 5410 family from Fluke offers today s widest choice of TV and video test signals from a range of compact instruments. These versatile generators incorporate leading-edge exper
Used SMT Equipment | In-Circuit Testers
Philips PM5418TDS Philips/Fluke PM5418TDS TV Signal Generator The PM 5410 family from Fluke offers today s widest choice of TV and video test signals from a range of compact instruments. These versatile generators incorporate leading-edge exper
Industry News | 2013-07-17 19:05:42.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-07-19 11:33:18.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
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Parts & Supplies | Pick and Place/Feeders
DEK BELT 145099 [.Neo 03ix] Horizon Neo 03ix Printer [..137516/215607/03128529] Bom assy board clamp foil 500mm 137516 [.Horizon 03ix] DEK Printer Horizon 03ix Machine [.HORIZON 03IX] DEK HORIZON 03IX PRINTER [.Horizon 02i] DEK Horizon 02i Scre
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Parts & Supplies | Pick and Place/Feeders
DEK BELT 145515 [.Neo 03ix] Horizon Neo 03ix Printer [..137516/215607/03128529] Bom assy board clamp foil 500mm 137516 [.Horizon 03ix] DEK Printer Horizon 03ix Machine [.HORIZON 03IX] DEK HORIZON 03IX PRINTER [.Horizon 02i] DEK Horizon 02i Scre
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
SAP26 series are semi-automatic printers developed by EMS Technologies, Pune. With various configuration available such as Camera attachment, settleable squeegee motor speed SAP26 printer range is suitable for wide variety of applications. Features:
►Contact Us◄ Sales manager: Mac Xie Mobile:86-18020714662 Email: at@mooreplc.com Skype:+8618020714662 ►Contact Us◄ ►Product Details◄ Extended Product Type:CM572-DP Product ID:1SAP170200R0001 ABB Type Designation:CM572-DP EAN:4016
Career Center | , | Engineering,Production
Industrial Engineer Will perform classical industrial engineering duties for assembler of electronics for the automotive industry. Requirements: BSIE At least 2 years industrial engineering experience in electronics (SMT) manufacturing. Expe
Career Center | , New Hampshire USA | Management,Purchasing
My firm represents a successful and growing Contract Manufacturer and requires a Supply Chain director who can manage large contracts, manage material and procurement activities, distribution and central stores areas. Must have a good track record o
Career Center | Titusville, Florida USA | Human Resources
Interview scheduling via Leo/Zoom, onsite, travel, onboard integration to include directors, HR staffing and interns, Welcome First Day communications, Sterling BGI support, Prehire Covid tracking, I9 administration, college team surge support, Y1X
Career Center | chennai, India | Quality Control
3 years experience in production department and 1.5 years in Quality department. and also knowledge in SAP. In Quality department, line inspection, incoming quality and final inspection are inspect and measured by vernier, Micrometer. and maintain by
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/fully-automatic-high-end-bga-smd-rework-station-model-zm-r8650
(such as 5G communication boards), automatic welding, and automatic PCB soldering station. This automatic SMD soldering rework station machine can be combined with SAP/ERP to realize the software linkup (optional
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