New Equipment | Rework & Repair Equipment
Semi automatic bga rework station machine to desolder and solder chip on mobile pcb Features: 1. Made of quality heating material;desoldering and solding procedures of BGA are precisely controlled; 2. Movable heating head,which can be moved
A reader, an electrical tag and data management system constitute an integrated RFID system. Radio Frequency Identification (RFID) is also regarded as a type of automatic identification technology. It carries out non-contact bidirectional data commun
Electronics Forum | Wed Jul 14 16:59:52 EDT 2010 | swag
Solder paste on the pads will keep part aligned. If you do not use paste, you will need to apply tacky flux. You should not run without one or the other.
Electronics Forum | Mon Nov 07 16:31:47 EST 2005 | CW
hi Bob, Thanks for the info. I understand your comments, but I am looking for specific guidance, If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? (I realize this is dependent on h
.png)
Used SMT Equipment | Pick and Place/Feeders
The NPM-TT2 (Next Production Modular-Twin Tray II) platform represents the next generation in twin tray modular production from Panasonic’s award-winning NPM platform—ideal for any mix. Further bolstering the SMT process to accommodate m
Used SMT Equipment | Pick and Place/Feeders
Samsung Samsung CP45FV-Neo advantages: 1, simple operation, flexible line change: Samsung's CP and SM series Mounter is recognized by the industry's most simple operation of the model, which uses WinXP system, compatible with Gerb files,
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Parts & Supplies | Pick and Place/Feeders
Supply JUKI 2080 laser 8005674 and repair Other juki parts: 40045126 HEAD L UP/DOWN SENSOR ASM 40045127 HEAD R UP/DOWN SENSOR ASM 40045132 HEAD L EJECTOR ASM 40045133 HEAD R EJECTOR ASM 40045135 FAN MOTOR(X MOTOR) ASM 40045136 LASER SENSOR CON
Parts & Supplies | Pick and Place/Feeders
SMT Samsung feeder SM16mm for pick and place machine Samsung SM/CP40 CP45 Feeders models: SAMSUNG SM 8*2mm FEEDER SAMSUNG SM 8*4mm FEEDER SAMSUNG SM 12mm FEEDER SAMSUNG SM 16mm FEEDER SAMSUNG SM 24mm FEEDER SAMSUNG SM 32mm FEEDER SAMSUNG SM
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt machine,LED Pick and Place Machine,LED Pick and Place,led pic
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Crawfordsville, Indiana USA | Engineering
We are assisting a large renowned leader in the lighting industry in filling positions in the Surface Mount Technology department. Facility is located in Indiana. The roles they are looking to fill are Quality Engineer, Electronic Test Technician,
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
assembly process root cause and not related to the absence or presence of voids in the solder joints. Therefore, subsequent data analysis did not include the data for component reference designator U1. BGA 56 - typical voids 0% 10% 20% 30% 40% 50% 60% 70% 80
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/how-to-monitor-and-track-height-sense-data
Data How to Monitor and Track Height Sense Data Accurate height sensing is important for consistent dispensing of precise lines and dots because it keeps the valve at the desired distance from the part
