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New Equipment | Industrial Automation
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Electronics Forum | Thu Aug 08 13:05:45 EDT 2019 | horchak
What is your pad width? What is lead width? Is the part gang masked, or has masking between the pads? Pads plated or HASL, if HASL how thick? What is board thickness and size? Does it need to be fixtured for support thru out the process. Semi auto sc
Electronics Forum | Sun May 21 23:29:38 EDT 2017 | zsoden
Hi all, We run an old Seho 1135C wave solder with a 63/37 pot at 250°C. It has been running well for a couple of years but we have noticed lately that all of the larger pads (terminal blocks, transformers, etc.) require additional solder to be appli
Electronics Forum | Tue May 23 02:32:33 EDT 2017 | bukas
hello Zac, if you are running pump at 100% and there is not enough wave then you will probably need to empty solder bath and clean everything. also check pump parts for tear and wear. eached solder inlet can make a lot of problems when it comes to w
Electronics Forum | Mon Mar 18 10:33:27 EDT 2013 | babe7362000
It is not the feeders having the issue. The tape on the strip of parts does not want to pull up easily. I just wondered if anyone else out there is having the same issue. Thanks for any feedback.
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Electronics Forum | Tue Apr 02 22:58:10 EST 2002 | davef
Whatever I've said, my intent has never been to insult you. Smack you yes, insult you no. True, you never said the word �strings� but you did say � * �� shouldn't I be able to expect enough green strength from my epoxy to hold 0603 caps in place wi
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
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