New Equipment | Assembly Services
PentaLogix offers three levels of PCB assembly services: Kitted You provide all the parts, including the bare printed circuit boards and electronic components, and we assemble your boards using our state-of-the-art automated equipment. Partially
New Equipment | Assembly Services
Turn-key PCB Assembly Services It takes on average of 15 hours to find and order parts for a typical pcb assembly order. Save time by letting us do it for you. No need to coordinate multiple vendors, pieces and parts. One purchase order fo
New Equipment | Cable & Wire Harness Equipment
Overview The UniStrip 2015 is a pneumatic wire and cable stripping machine and the perfect solution for stripping discrete wires and small multi-conductor cables up to 3.2 mm (0.12") O.D. The compact machine strips lengths up to 20 mm (0.78").
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
The CoaxStrip 5400 is a semi-automatic, programmable stripper designed to perform both single and multiple stage strips. Production proven mechanics, combined with state-of-the-art electronics, a user-friendly display and included PC software create
The UniStrip 2550 is a fully programmable stripping machine, offering high precision and flexibility. It strips wires ranging in size from 0.03 - 6 mm² (32 - 10 AWG) and jacketed cables up to 5.5mm (0.22") in diameter. The machine comes standard with
The RotaryStrip 2400 is the next generation single conductor bench top wire stripping machine, which easily strips Teflon, Kapton and Fiberglass insulated wires with optional twisting of the inner strands. This fully programmable machine, featuring a
Industry Directory | Manufacturer's Representative
SMT assembly equipment including placement, reflow & vapor phase soldering, cleaning, X-Ray, AOI, SPI, conveyors. First Article Inspection (FAI). Consumables, splicing systems & tools, splice tape & clips. Understencil wiping Roll
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
For over 30 years, V-TEK International has been a global leader in the electronic component packaging and processing industry by providing cost-effective component packaging and processing options with fast return on investment.
Industry Directory | Manufacturer
A printed circuit board manufacturer producing high quality prototype printed circuit boards.
