New Equipment | Component Programming
The JTAGMaster Tester and Programmer is a fully integrated solution for the configuration and diagnosis of Programmable Logic Devices (PLDs). This unit includes : * A boundary-scan tester to arbitrarily observe individual pins and therefore determine
Electronics Forum | Fri Mar 24 15:31:08 EDT 2017 | elrohir
I have a supplier that want to upgrade all nails on a huge amount of ICT fixture due to test RoHS compliant PCBAs. My thought is that even if there are a very small fraction of residues left on the pins it will never go over the 1000PPM level. In fu
Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
Industry News | 2011-09-06 15:20:36.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.
Industry News | 2017-11-08 07:18:03.0
XJTAG, a world leading supplier of boundary scan technology and Systech Europe, a leading European provider of electronic test solutions, today announced the availability of an integrated solution using XJTAG boundary scan and Takaya’s flying probe system.
Technical Library | 2020-10-18 19:35:05.0
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes.
Technical Library | 2016-10-27 16:24:23.0
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors. The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes, Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering, rework, thermal cycles, installation and repair. This paper investigates the technical roadmap for press fit technology, putting special attention to main characteristics such, placement and insertion, inspection, repair, pin design trends, challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/default-pad-shape-for-sop-and-soic-packages_topic522_post3913.html
: 20 Mar 2012 Location: Oxfordshire, UK Status: Offline Points: 576 Post Options Post Reply Quote jameshead Report Post Thanks(0) Quote Reply Posted: 30 Aug 2012 at 7:10am I'm in the 40% then. I use the oval as default and a rounded rectangle to indicate pin 1
| https://unisoft-cim.com/cells.php
) compliant database such as Oracle, Microsoft SQL Server, Microsoft Access, MySQL, etc. The data is open for queries such as routing progress status and quality
winsouce.jpg)
