Full Site - : passive (Page 14 of 135)

Source 1 Solutions

Industry Directory | Distributor

We're a global distributor of electronic components, both active and passive. We are also a service disabled veteran owned small business.

Inventum Electronics

Industry Directory | Distributor

With a special focus on obsolete and hard to find parts, Inventum Electronics is a leading source in allocating electronic components: active, passive and electromechanical components, IC's, semiconductors, connectors, & hardware.

SUNLORD ELECTRONICS TECHNOLOGY

Industry Directory | Distributor

Sunlord focus on adding values in passive components supply chain. Product distributed and supported include capacitor, inductor, resistor, discrete components, connector, RF components etc.

Perfect Parts Corporation

Industry Directory | Distributor

Perfect Parts is a distributor of Electronic Components. Whether you are in need of electromechanical devices, passives, semiconductors, or interconnect products. We stock a broad array parts.

Active & Passive Components

New Equipment |  

Capacitors Connectors CPUs / Microprocessors Crystals Diodes Discrete Semiconductors DRAM Flash Fuses IC Sockets Inductors Integrated Circuits (ICs) Memory (All Types) Microcontrollers Microprocessors / CPUs Optos Oscillators Relays Resistors Resisto

Smith & Associates

Electronic Expeditors Inc.

Industry Directory | Manufacturer

Electronic Expeditors, Inc. (EE) is a distributor of passive electronic and electro-mechanical component parts.

Quoting Specialist

Career Center | Tampa, Florida USA | Purchasing

Quote Specialist The selected individual will possess a minimum of 2 years experience with semiconductors and / or passive electro-mechanical products; strong product knowledge and cross referencing skills; strong PC skills (Excel); and excellent int

Reptron Electronics, Inc.

Design and Process Development for the Assembly of 01005 Passive Components

Technical Library | 2018-03-05 11:22:48.0

Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.

Sanmina-SCI

Embedded Passive Technology

Technical Library | 2014-01-09 16:40:33.0

Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology have a great potential for high frequency and high density applications. It also provides better signal performance, reduced parasitic and cross talk. This paper summarizes the selection of resistor embedded materials, evaluations of resistive material (Phase 1) and duplication of a complex digital design (Phase 2). Phase 1 –resistive materials (Foil 25Ω/sq NiCr and 1kΩ/sq CrSiO) and resistive-Ply materials (25Ω/sq and 250Ω/sq NiP) were chosen for evaluation.

Honeywell International

Embedding Passive and Active Components: PCB Design and Fabrication Process Variations

Technical Library | 2016-06-16 15:29:31.0

Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.This paper focuses on six basic embedded component structure designs described in IPC-7092.

Vern Solberg - Solberg Technical Consulting


passive searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers
Blackfox IPC Training & Certification

High Throughput Reflow Oven
SMTAI 2024 - SMTA International

World's Best Reflow Oven Customizable for Unique Applications
High Throughput Reflow Oven

Component Placement 101 Training Course
PCB Depanelizers

Low-cost, self-paced, online training on electronics manufacturing fundamentals