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IPC Releases Attendance Numbers for IPC Printed Circuits Expo� 2003

Industry News | 2003-04-14 09:29:49.0

More than 3,000 visitors gathered in Long Beach, Calif., for IPC Printed Circuits Expo� 2003, held March 23-27

Association Connecting Electronics Industries (IPC)

Updated Information on the IPC/ HKPCA Dongguan 2004 Event

Industry News | 2004-09-22 20:15:15.0

IPC and HKPCA�s premier industry event, International Printed Circuit and Electronics Assembly Fair will be held in Dongguan, China from December 8-10, 2004

Association Connecting Electronics Industries (IPC)

Call for Papers: International Conference on Soldering and Reliability

Industry News | 2010-01-22 21:37:52.0

Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.

Surface Mount Technology Association (SMTA)

IPC International Conference Offers Answers to Chalenges of Flexible Circuits.

Industry News | 2010-03-27 19:38:34.0

BANNOCKBURN, Ill, USA, - One of the fastest growing segments of the PCB market worldwide, flexible circuits provide new opportunities in the areas of creative design, miniaturization, circuit density and interconnection reliability to help boost a company’s bottom line.

Association Connecting Electronics Industries (IPC)

The SMTA Capital Chapter Invites You to Attend Its Annual Expo and Tech Forum on August 23, 2012

Industry News | 2012-08-09 18:20:49.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on August 23, 2012 from 9:00 am until 3:00 pm.

Surface Mount Technology Association (SMTA)

Program Finalized for Counterfeit Electronic Parts West

Industry News | 2012-10-10 17:26:45.0

SMTA and CALCE are pleased to announce that the program is finalized for the Counterfeit Electronic Parts and Electronic Supply Chain Symposium West. The program is available on-line at www.smta.org/counterfeit and registration is open

Surface Mount Technology Association (SMTA)

Solder Paste and Solder Joint Automatic Inspection Experience at SMTA International

Industry News | 2015-07-06 10:34:12.0

The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.” This special feature will take place during both days of the SMTA International Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois on September 29 - 30, 2015.

Surface Mount Technology Association (SMTA)

SMTA International 2015 Papers Now Available in SMTA Knowledge Base

Industry News | 2016-04-30 13:11:50.0

The Technical Conference Proceedings from the SMTA International Conference and Exhibition (SMTAI) 2015 are now available for download from the SMTA Knowledge Base, it is announced today.

Surface Mount Technology Association (SMTA)

SMTA International 2016 Best Papers Announced

Industry News | 2016-12-20 13:18:31.0

The SMTA is pleased to announce the Best Papers from SMTA International 2016. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, Best International Paper, as well as a $500 award for Best Student Paper.

Surface Mount Technology Association (SMTA)

Camalot Announces PCB Temperature Monitoring on Prodigy Dispenser to Ensure Underfill Process Stability

Industry News | 2020-04-14 18:28:48.0

ITW EAE is introducing a patent pending option for the Camalot Prodigy dispenser that was developed to ensure process stability and increase yields for underfill applications. In applications where board heat is required, a constant product temperature through the dispense process is critical to ensure process stability and repeatability. Underfill materials vary in viscosity and filler types, therefore the heat requirement for the board also varies.

ITW EAE


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