Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef
We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac
Electronics Forum | Mon Jul 04 22:09:08 EDT 2005 | grantp
Hi, I have one for sale, do you want it! MYDATA machines are perfect for low volume high mix production, and are fairly easy to operate. Don't get a TP model, as they cannot take the HYDRA head, and the MY series are much better. The good thing is
Electronics Forum | Thu Oct 22 14:39:22 EDT 1998 | Chrys
| My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I
Electronics Forum | Thu May 08 10:16:17 EDT 2003 | davef
Observations are: * Center most lead of the fuse on the top right of the assembly looks like it has excellent solder flow, but this is PTH. From the amount of solder, it must have been wave or hand soldered. * Center most lead of the fuse on the bot
Electronics Forum | Mon Oct 06 08:51:26 EDT 2003 | davef
The EIA does not provide that information. EIA standards focus on component dimensions. Alternately consider: ...cut... SM-782A - Surface Mount Design & Land Pattern Standard, Inc. Am. 1 & 2 ANSI Approved Get up-to-date land pattern recommendat
Electronics Forum | Tue Aug 18 10:11:04 EDT 2009 | grantp
Hi, Yes, I think this sounds like a form of tomb-stoning, and we used vapor phase until it ended up driving us totally nuts trying to deal with tomb-stoning. We tried everything, and all kinds of stencil apertures. Vapor phase is an amazing process
Electronics Forum | Sat Jan 29 04:59:02 EST 2005 | Grant
Hi, MYDATA's are ok for lower volume, and they are very flexible. If you only have 1 or 2 trays of components and are on a tight budget, then you can even place the trays on the Y wagon behind the PCB so you can get away without the tray wagon. Al
Electronics Forum | Tue Aug 25 08:51:16 EDT 1998 | Justin Medernach
| | | Hi, | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | We have rule out the possibility of not printing any
Electronics Forum | Mon Jan 10 17:12:53 EST 2011 | gosswald
I have been researching older lower cost used Pick and Place machines and so far I am leaning towards the Quad IV C. There seems to be a fair amount of these units around and I have heard some pretty good things about them on some of the past posts.
Electronics Forum | Thu Apr 09 09:25:04 EDT 1998 | Terry Burnette
| I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have
