Electronics Forum | Wed May 19 11:02:41 EDT 1999 | Glenn Robertson
| I am designing a component for surface mount. Does anybody out there specialize in the design of passive components for SMT? Can you recommend a good reference? | Raffi - Many companies have their own specs for parts, but I suggest you check
Electronics Forum | Fri Aug 24 14:15:24 EDT 2007 | clarkk
Ben, I'm not aware of any 'automatic' method to convert PTH footprints to SMT. Typically, many of the components are passives, and there may be a way in your CAD software to change the passives of a common size to a different footprint. That will co
Electronics Forum | Tue Aug 12 07:35:23 EDT 2008 | stevezeva
Hi, Is the footprint per the component manufacturers recommendations? The reason I ask is because it kinda looks like the pads are extending beneath the component. Could cause the part to float up on top of the solder and not allow the leads to wet
Electronics Forum | Tue Apr 29 20:26:03 EDT 2008 | sys_steven
You can adjust to 45mm clearance, But I would recommend staying at 25mm if working with fine pitch and smaller passive components.
Electronics Forum | Wed Jan 07 05:53:05 EST 2009 | sm2009
Hello, does anyone know if it's possible to wave solder 0402 components? Are there drawbacks? Where can I find technical details about recommended footprint and glue point? Last question: are there suggestions about wave soldering for ic with 0,635mm
Electronics Forum | Wed Jan 30 13:17:22 EST 2019 | slthomas
In addition to robl's suggestions, I would look at the footprint on the board to make sure it meets the recommended dimensions. Abnormal layouts, particularly when pads extend under the component too far, can be problematic both by lifting the part
Electronics Forum | Thu Nov 30 10:49:05 EST 2023 | carl_p
You might find what your looking for in the component datasheet or at least a recommended footprint. As your looking for advise I would speak with whomever you have your stencils designed by at the min, they likely already have a database of options
Electronics Forum | Wed Nov 16 17:18:42 EST 2022 | emeto
Volumes are not the only factor here. You might have low mix and low volume, but high complexity. Machine you pick based on the most challenging components you have to print/place/reflow. If boards are simple, than your level of expertise is importan
Electronics Forum | Fri Dec 19 12:43:01 EST 2014 | emeto
I had some of these before and they do a decent job. Laser alignment is ok for passive components. Compared to vision systems it has mainly disadvantages. If you have bended lead on IC for example, it wouldn;t catch it and it will place the part. I w
Electronics Forum | Wed Apr 17 08:35:17 EDT 2013 | emeto
I currently run Siemens and they have their own recommendations about placement force. Most of the passive parts will be placed using 2N. For some BGA'a we will go about 4N and for certain parts that are very easy to break you should go 1N. All parts
