Used SMT Equipment | General Purpose Test & Measurement
We ship worldwide. Please feel free to contact us if you need further information. Agilent 81949A Compact Tunable Laser Source, 1520nm to 1630nm Key perfomance values High optical output power: +13 dBm Wide tuning range: 1520nm-1630nm Absolute
Used SMT Equipment | General Purpose Test & Measurement
Key Features & Specifications High optical output power: +13 dBm Wide tuning range: 1465nm-1575nm Built-in wavemeter for excellent accuracy: +/-20pm Built-in coherence control Stimulated Brillioun scattering suppression Description Keys
Used SMT Equipment | In-Circuit Testers
Wavetek CLI-1750 Cable Leakage Signal Meter Signal Level, Leakage & Home Wiring Test Kit JDSU CLI-1750 Designed for use by installers, the Wavetek/Acterna/JDSU CLI1750 and LST1700 are easy to use, portable, and economical solutions that perform
Introduction of new model ST-5 of Smart Tweezers LCR-meter from Siborg Systems Inc, Waterloo, Ontario, Canada, http:\\www.smarttweezers.ca
Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Multilayer Mixed Dielectric PCB Specifications:
Industry Directory | Manufacturer
Labtech is a UK based specialist high technology company offering Broadband Microwave Components and a range of related Microwave Manufacturing Services. Labtech is a subsidiary of Intelek plc www.intelek.plc.uk , a LSE listed company.
This multilayer, high-frequency coupler, shown above, is used within a communications application for the telecom industry. Multilayer High Frequency Coupler Specifications: Product Description This Multi-Layer High-Frequency Coupler is used with
New Equipment | Test Equipment
The REVETEST® Scratch Testing instrument has become the industry standard for measuring hard-coated materials, with a typical coating thickness of several microns. Coatings may be organic or inorganic, covering Tribological, magnetic and decorative
Technical Library | 2021-01-28 01:55:00.0
Printed circuit board surface finishes are a topic of constant discussion as environmental influences, such as the Restriction of Hazardous Substances (RoHS) Directive or technology challenges, such as flip chip and 01005 passive components, initiate technology changes. These factors drive the need for greater control of processing characteristics like coplanarity and solderability, which influence the selection of surface finishes and impact costs as well as process robustness and integrity. The ideal printed circuit board finish would have good solderability, long shelf life, ease of fabrication/processing, robust environmental performance and provide dual soldering/wirebonding capabilities; unfortunately no single industry surface finish possesses all of these traits. The selection of a printed circuit board surface finish is ultimately a series of compromises for a given application.
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
