Full Site - : passive component shear test (Page 19 of 45)

Nordson Test & Inspection Announces Lineup for productronica

Industry News | 2017-10-17 19:47:15.0

Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.

Nordson DAGE

Cookson Electronics and Practical Components� Introduce Lead-Free Process Capability Program

Industry News | 2004-06-24 17:35:13.0

New Lead-Free validation kit and service smoothes transition to "green" electronic assembly.

Practical Components, Inc.

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Industry News | 2017-01-29 09:37:08.0

TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

Speedline Technologies, Inc.

PCB Assembly

PCB Assembly

New Equipment | Assembly Services

Our extensive PCB assembly expertise incorporates: Prototypes and pilot builds Conventional electronics assembly Surface mount assembly State-of-the-art equipment RoHS and non-RoHS facilities Cost effective design Core to the JJS Electronics m

JJS Electronics LTD

Nordson to Exhibit Full Range of Market Leading Test and Inspection Systems at SMT/Hybrid/Packaging 2016

Industry News | 2016-04-04 09:33:43.0

Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.

Nordson DAGE

Heraeus Electronics Develops New Production Friendly Flexible End Termination Ink

Industry News | 2023-04-03 13:41:12.0

Heraeus Electronics is pleased to announce the development of a production friendly, flexible passive component termination ink. ET2010 Flexible End Termination Ink is a first of its kind material in the market utilizing advanced polymer technology. When compared to current thermoset, epoxy-based inks in the market, Heraeus' solution offers easier shipping, storage, and handling at room temperatures.

Heraeus

Electronic Components, Parts and Their Function

Industry News | 2018-12-08 03:22:25.0

Electronic Components, Parts and Their Function

Flason Electronic Co.,limited

EP-TeQ – signs Nordic & Baltic distribution contract with Digitaltest GmbH

Industry News | 2013-05-24 18:52:24.0

EP-TeQ A/S, the Partner in consulting, sales, service and support of equipment for Electronic Production and Quality Assurance, announces that they have signed a contract with Digitaltest for sales of their hardware and software products for the Nordic and Baltic Countries.

Digitaltest Inc.

ATE Spring Pin BGA Socket for Digital Camera Processor

Industry News | 2011-01-12 15:27:11.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.

Ironwood Electronics

Chipset Specific, Integrated Passive Devices (IPDs) Simplify Development of Next Gen Wireless IoT Applications

Industry News | 2020-11-02 12:40:17.0

Miniaturized, front-End IPDs are specifically designed to seamlessly connect with Semtech's LoRa® SX1261, SX1262, and LLCC68 Chipsets

Johanson technology


passive component shear test searches for Companies, Equipment, Machines, Suppliers & Information