Full Site - : passive component shear test (Page 36 of 45)

Shear Test Results

Electronics Forum | Mon Dec 17 07:34:07 EST 2001 | Adam

Dear Colleagues Does anyone know or care to share any information as to typical torque values ( N/cm ) for components that have been placed using screen printing surface mount adhesive, using a plastic stencil ? Are there any industry set shear test

Gluing Quality Issue !!!

Electronics Forum | Thu Nov 05 16:56:38 EST 2009 | lynn_norman

In a previous job, we had torque off requirements for different sized components for our screen print adhesive (non-conductive in our case). We used a torque watch that would measure max torque, so we could test production boards, shear testing was

Gluing Quality Issue !!!

Electronics Forum | Thu Nov 05 03:40:34 EST 2009 | valeo

Hi Rajeshmara, Mail sent with the datasheet of the glue we use in production. Thanks for first information you provide me for the shear specifications on 1206. But can you be more precise on this point ? How did you define it ? Is anyone have more

Evaluating SMD Adhesives

Electronics Forum | Mon Aug 27 15:02:45 EDT 2001 | davef

It�s uncommon to test green strength. [Whatever �green strength� is. Some chip bonder adhesive suppliers have taken to taking about improvements in �green strength� their literature. We have asked sales types to quantify this and have never heard

Solder Joint Strength

Electronics Forum | Thu Mar 31 19:41:36 EST 2005 | Dreamsniper

Can anyone guide me to what test do I need to be able to identify the strength of my fine pitch component solder joint? What value is available that I can use as a reference? Say 1.5 kg, 2.0 kg, 2.5 kg etc. I would like to have my fine pitch compone

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef

We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng

BGA Device with Slanted and Damaged Spheres

Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison

We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the

glue measurement

Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand

Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.

Re: Adhesive Evaluation

Electronics Forum | Fri May 14 11:24:00 EDT 1999 | Chrys Shea

| Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks | My torque watch came from Waters Manufacturing, Inc. A div of Talley Industries. Longfellow Center, Wayland Mas

Re: Adhesive Evaluation

Electronics Forum | Fri May 14 12:13:55 EDT 1999 | P.L. Sorenson - Technical Consultant

| | Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks | | | My torque watch came from Waters Manufacturing, Inc. A div of Talley Industries. Longfellow Center, Wayla


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