Electronics Forum | Wed Oct 06 03:18:01 EDT 2004 | Joseph
Dear all, Recently our customer complaint that some components being came off from the pcba after dropping test.But the curious is, the leads show visible solder fillet covering more than 75% of termination area on pad, which is acceptable as per IP
Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Fri Nov 07 18:12:50 EST 2014 | cot628
This issue is coming from a customer. The customer demands that we do not mechanically center or test passive components, because of issues they had in the past. There has been a studies that it takes about 8-10 newtons to damage chip. Most of our pa
Electronics Forum | Mon Aug 27 08:16:23 EDT 2012 | rway
No, in his case an ICT in not out of the question. An ICT, especially with many passive components, can give you piece of mind that the assembly was built correctly. Even with the addition of an automated insertion machine, you still run the risk o
Electronics Forum | Fri Jun 06 16:25:03 EDT 2014 | spitkis2
Component manufacturers subject their lots to thermal / reflow testing per IPC /JEDEC STD-020. This involves running the parts through an oven 3X with a peak above 260C. I am not certain if passives go through the same test (theoretically they shou
Electronics Forum | Wed Sep 29 09:35:39 EDT 2010 | blnorman
Can any body help me that how can I check the > strength of the 0603 capacitor & how much it > should be? Is there any standard for the > soldering strength of the Diffrent SMT > packages. Manjeet singh I'm not aware of a standard that provides
Electronics Forum | Wed Mar 30 16:07:24 EST 2005 | Dreamsniper
If there's no shear strength standard for solder joint, how will I define my pad width and length then. I have a 8.5 mils width and my component lead width is 8.66 mils based on manufacturer's minimum width specification. How will I identify that it
Electronics Forum | Mon Dec 16 00:08:18 EST 2019 | ameenullakhan
Hi Norah, Thanks.. Components are stored in controlled environment of 20 to 25 deg c & 40 to 60 % humidity. Baking wont be feasible for many parts. Mainly for passive parts in tape and reel. 0402, 0603 & 0805 packages. Cold baking is not feasible
Electronics Forum | Mon Mar 01 09:49:04 EST 1999 | Justin Medernach
| It seems to be that we have to much NaCl left on our assambled PCB's. | The flux we use is from cobar. They say it can not be from the flux... So what can be the reason, what kind of problem may occer when there is to much NaCl. | George, Are you
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