Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
Electronics Forum | Fri Feb 13 11:22:17 EST 2015 | slarochellesmt
I can offer some background on the IINEO II as I feel it is much better than the Yamaha. I currently have 3 IINEO IIs in production that replaced 3 Assembleon lines. The IINEOs handle quick changeovers better than any SMT line that I have used to d
Electronics Forum | Tue Oct 16 07:00:06 EDT 2001 | genglish
Hi all, I have a problem and would gratefully take on suggestions, firstly let me explain the situation: We are currently screen printing adhesive, using a method similar to DEKs 'Pump Print', The adhesive we are currently using is supplied from Alp
Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Fri May 20 03:14:03 EDT 2016 | designhaus
Hello, We are about receive an 85.000 USD award grant towards purchasing manufacturing or testing equipment for our company. We are trying to figure out how to best use this grant. Here are short facts about us: We are a design house, so all our ma
Electronics Forum | Mon Jun 14 15:50:07 EDT 1999 | JohnW
| I am looking for more information about: | | 1) What kind of evaluation can I do to measure the resistance to fall off of a bottom side glueded SMT component?; | | 2) There is some influence of doble wave solder machine (temperature, flux, etc) i
Electronics Forum | Mon Apr 13 16:37:26 EDT 1998 | Steve Gregory
| Wondering if anyone has information on percentage of components that we | can expect to "lose" during our SMT process. We are new to SMT, using | QUAD machines and feel we are losing to many parts during our process. | We are spending a lot of tou
Electronics Forum | Wed Apr 21 18:24:13 EDT 2004 | pjohnson@volterra.com
Simple process - we use similar Kester solder brands of "no clean" low residue solder wick to clean our pads, then brush with isopropyl, and apply Kesters brand of tacky flux under a Leica 6x microscope. We do this on 7x7mm and 9x9mm packages. This w
Electronics Forum | Tue Jul 10 11:25:36 EDT 2007 | jax
Multiple Factors that account for Scrap: During Set-Up: A percentage will not work. When setting up feeders you will normally use a certain length of populated pockets. The amount of parts this affects depends on 1.type of feeder 2.type of part
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