Industry Directory | Distributor
General Line Distributor of Board Level Electronic Components
Industry Directory | Manufacturer
The Mulpin concept is to embed components, both active and passive, into multi-layered Printed Circuit Boards (PCBs).
Industry Directory | Manufacturer
The Mulpin concept is to embed components, both active and passive, into multi-layered Printed Circuit Boards (PCBs).
Industry Directory | Distributor / Other
Supplier of passive and active components, SMT resistors and resistor kits.
Industry Directory | Consultant / Service Provider
Custer Consulting Group provides market research, business analyses and forecasts for the electronic equipment and solar/photovoltaic supply chains.
Capacitors Connectors CPUs / Microprocessors Crystals Diodes Discrete Semiconductors DRAM Flash Fuses IC Sockets Inductors Integrated Circuits (ICs) Memory (All Types) Microcontrollers Microprocessors / CPUs Optos Oscillators Relays Resistors Resisto
Industry Directory | Distributor
We are one of the leading distributors of electronic components. Our cooperation brands: XILINX, ALTERA,ST,TI, AMD,INFINEON, INTEL, BROADCOM,NXP etc.
Industry Directory | Manufacturer's Representative
Caesar Group the main areas: Electronics Manufacturing Service(OEM/ODM), Electronics Components (Active/Passive), Environmental Solution and Engineering Plastics.
Technical Library | 2016-06-16 15:29:31.0
Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.This paper focuses on six basic embedded component structure designs described in IPC-7092.
Industry Directory | Manufacturer
Designer and manufacturer of semiconductor packaging and resistive components including terminations, resistors and attenuators.
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