Used SMT Equipment | In-Circuit Testers
Agilent 81640A-071 Tunable Laser Module low SSE 1600 The Agilent 81640A tunable laser source covers both C- and L - Band. It is specially designed for testing critical DWDM passive components. This Agilent "A" Tunable Laser Source has been rep
Used SMT Equipment | General Purpose Test & Measurement
Agilent-Keysight 81640A-072 Tunable Laser Module low SSE 1600 The Agilent 81640A tunable laser source covers both C- and L - Band. It is specially designed for testing critical DWDM passive components. This Agilent "A" Tunable Laser Source has
Career Center | West Chester, Ohio USA | Engineering,Purchasing
Responsible for development of passive or active supplier quality on existing programs after production launch. Manage supplier corrective action after defect is confirmed. Develop suppliers, PO requirements, relevant specifications. Evaluate suppl
Industry Directory | Distributor
We are independant stocking distributor of semiconductors, passive and relays, and electron tubes established since 1947. We are located in Belgium and serve OEM's, distributors and users worldwide.We are a product specialist meet
Industry Directory | Manufacturer
Own design & production from DFB LD chip, passive components, modules and rackmount type in optic and data market.
Technical Library | 2015-02-27 16:46:30.0
During the last period of newly assembled electrical devices (pcbs), new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements based on the automotive and industrial industry. In the narrow gaps under components, residues can accumulate more by the capillary forces. This is not that much a surface resistance than an interface issue. Also that the flux residues under such types of components creates interaction with the solder resists from the pcb, as well as the component body was not completely described in the standard SIR measurement. On the other hand also, electrical influence with higher voltage creates new terms and conditions, in particular the combination of power and logic in such devices. The standard SIR measurement cannot analyze those combinations.The paper will discuss the requirements for a measurement process, and will give results. The influences of the pcb and component quality will also be discussed. Furthermore it will describe requirements for nc solder paste to increase the chemical/thermical/electrical reliability for whole devices
Industry Directory | Distributor / Manufacturer
An authorized, stocking distributor of electronic components, passives and discrete semiconductors that are available for same-day shipping.
Industry Directory | Consultant / Service Provider
Supermax ECAD - Advanced EDA solutions for PCB, MCM & Hybrid design. Supports all types of designs including RF, Microwave, High-Speed and Advanced Packaging.
Career Center | Aurora, Illinois USA | Quality Control
Manufacturer of passive fiber optic components and cabling seeking a "hands-on" lead quality engineer with strong knowledge of fiber optic design and manufacturing. Ability to manage the efficiency and effectiveness of the quality system, and audi
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
