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Assembly Challenges of Small Packages - A Tech Symposium Presented by Industry Experts

Industry News | 2015-09-01 15:13:52.0

Please join BEST for our 2015 Tech Symposium on the Assembly Challenges of Small Packages. Increase your understanding of the challenges involved in small footprint device assembly.

BEST Inc.

Mixed process of SMT reflow oven

Industry News | 2018-10-18 08:53:06.0

Mixed process of SMT reflow oven

Flason Electronic Co.,limited

SOLDER BALLS

Electronics Forum | Mon May 04 02:39:31 EDT 2009 | lococost

Have you contacted Cobar? They should have a sample of your batches of pasta they could analyse.

Re: SMT-Paddesign

Electronics Forum | Tue Mar 31 12:54:53 EST 1998 | Justin Medernach

| | Can someyone tell me where i can find some informations, | | about optimal design of footpad for pasta dispensing. | John, | Check out IPC-SM-782. This refers to surface mount pad design for surface mounted components. The spec is available fo

SMT-Paddesign

Electronics Forum | Mon Mar 30 11:35:20 EST 1998 | John Vestergaard

Can someyone tell me where i can find some informations, about optimal design of footpad for pasta dispensing.

Homebrew vapour phase...?

Electronics Forum | Wed Jun 16 15:39:15 EDT 2010 | mikesewell

Keep in mind you'll still need to preheat the assembly to properly activate the flux/drive off volatiles in the paste. Perhaps a convection toaster oven... Add some cooling coils and a freeboard/tube to the top of your pasta cooker or turkey fryer t

QFN welding problem by reflux oven 10 zones

Electronics Forum | Tue Feb 11 13:03:05 EST 2020 | astarotf

Evtimov The areas analyzed are a standard oven curve according to the pasta we are using. The channels used are only for measuring the oven temperature profile, not in detail of the QFN component sector.

QFN welding problem by reflux oven 10 zones

Electronics Forum | Tue Feb 11 17:05:53 EST 2020 | astarotf

Evtimov thank you very much for sharing this profile, we will perform tests with this curve to see behaviors in the oven and pasta.

Re: SMT-Paddesign

Electronics Forum | Mon Mar 30 12:46:14 EST 1998 | Justin Medernach

| Can someyone tell me where i can find some informations, | about optimal design of footpad for pasta dispensing. John, Check out IPC-SM-782. This refers to surface mount pad design for surface mounted components. The spec is available for purcha

Germanium doping of SN100

Electronics Forum | Thu Dec 20 16:32:54 EST 2007 | gsala

Over here in Eurolandia the following Allois are running like a piece of cake. http://www.krepro.no/tinn_pasta_fluss/NiGe-Stangtinn.pdf It is FUJI patent Formula, sold in Eurolandia by FELDER Germany Really a good help in the Lead Free Wave Solder

Sm t t t net
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