Industry News | 2023-10-09 09:21:57.0
Indium Corporation is proud to count three of its experts amongst the presenters participating in the technical program at the upcoming IMAPS International Symposium on Microelectronics, October 3-5 in San Diego, California, U.S.
Industry News | 2009-10-22 13:23:47.0
The DEK team is currently looking forward to showcasing an extensive range of innovative technologies from Stand A2.405 at this year’s Productronica exhibition, including its newly re-energized Horizon platform. Being held from 10th – 13th November in Munich, the 18th International trade fair for innovative electronics production will also host a wide range of DEK Productivity Tools along with the company’s brand new Sentinel technology.
Industry News | 2010-04-14 20:57:38.0
From the recently re-energized Horizon platform, through to comprehensive print process control tools and next-generation stencil technologies, the DEK display at Nepcon Shanghai will treat booth visitors to the ultimate in print productivity. Being held from 20th – 22nd April at the Everbright Convention & Exhibition Centre, the twentieth Nepcon Shanghai event will see DEK demonstrate a selection of advanced products and processes from booth 1E08.
Industry News | 2009-01-22 20:22:57.0
The DEK team is inviting visitors to this year's Southern Electronics Show to unlock the potential of their print process with a wide range of advanced technologies. Being held over 11th � 12th February 2009 at FIVE in Farnborough, UK, Southern Electronics will see the mass imaging leader showcase a wide range of Process Improvement Products and Productivity Tools designed to help customers 'expect more'.
Electronics Forum | Thu May 10 16:17:59 EDT 2001 | davef
I am unaware of any industry standard for specifying apertures for SM stencils. I am aware of IPC-7525, Stencil Design Guidelines. You can obtain it from IPC [http://www.ipc.org]. Further, it seems like there is an article on stencil design ever
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Mon Mar 21 12:02:09 EST 2005 | Rob
Hi Colin, Are you using the 1206 package with 4 elements or one of the higher density smaller packages? With the first type you can get them in both Convex or Concave terminations, with most of the solderability problems associated with using the C
Electronics Forum | Mon Jun 07 07:31:59 EDT 1999 | tannlin
| Hi everybody, | | Somebody know the advantages of electroformed stencils on laser cut stencils ? | | any coment is apreciated. | | | thanks | | Al Al I have a quote for you from one of the major CEM's "anyone who thinks they are controllin
Electronics Forum | Tue Jul 13 13:28:18 EDT 1999 | Upinder Singh
| | Hi all , | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | 1. Is underfill required for micro-BGAs? | | | | 2. What type of stencil apertures are the industry st
Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev
Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep
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