Full Site - : paste aperture vol. density (Page 1 of 5)

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

New Equipment | Printing

ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p

ASM Assembly Systems (DEK)

AMTECH

Industry Directory | Manufacturer

Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.

Hyproclean - SMT Stencil Cleaning Rolls for Ultra Fine Pitch Applications

Hyproclean - SMT Stencil Cleaning Rolls for Ultra Fine Pitch Applications

New Equipment | Cleaning Equipment

Hyproclean Stencil Cleaning rolls - Proven Superior Cleaning Performance especially in ultra fine pitch situations. Benefits:  Hyproclean stencil rolls give a high performance cleaning without having to use toxic chemicals in manufacturing the fabri

Swiftmode Malaysia (Penang) Sdn Bhd

Swiftmode's Hyproclean Under Stencil SMT Wiper Rolls are the only product in the market that has beed developed specifically for the application.

Swiftmode's Hyproclean Under Stencil SMT Wiper Rolls are the only product in the market that has beed developed specifically for the application.

Videos

Swiftmode's Hyperclean Under Stencil SMT Wiper Rolls are the only product in the market that has beed developed specifically for the application. Best vacuum performance, less IPA usage and No loose fibres making the solder paste printing process mor

Swiftmode Malaysia (Penang) Sdn Bhd

NicAlloy-XT™ Hybrid Stencils

NicAlloy-XT™ Hybrid Stencils

New Equipment | Solder Paste Stencils

Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own proprietary NiPlate™ technology, which fur

Photo Stencil LLC

MULTICORE Solder Pastes

MULTICORE Solder Pastes

New Equipment | Solder Materials

As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr

Henkel Electronic Materials

Stencil Printing Yield Improvements

Technical Library | 2014-06-05 16:44:07.0

Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.

KYZEN Corporation

HawkEye®  - High Speed Deposit Verification System

HawkEye® - High Speed Deposit Verification System

New Equipment | Printing

HawkEye is an automatic print verification technology that operates at the line beat rate. The system can be configured to assess 100% of printed boards and gives a rapid go/no-go indication for each, meaning that faulty boards can now be automatical

ASM Assembly Systems (DEK)

Seika Machinery Launches Sawa Automatic Ultrasonic Stencil/Screen Cleaner

Industry News | 2020-09-01 12:43:28.0

Seika Machinery, Inc. is pleased to introduce the Sawa SC-BM500E Automatic Ultrasonic Stencil and Screen Cleaner. The system is specifically designed for high-density SMT applications.

Seika Machinery, Inc.

Kyzen’s Informative Presentation at NEPCON South China Earns Best Paper Award

Industry News | 2013-08-30 09:54:58.0

Kyzen announces that it received a Best Paper award for its recent presentation during NEPCON South China, which was held from August 27-29, 2013.

KYZEN Corporation


paste aperture vol. density searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

Easily dispense fine pitch components with ±25µm positioning accuracy.
Electronic Solutions

Component Placement 101 Training Course
SMT feeders

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.