Electronics Forum | Tue Jul 23 12:56:03 EDT 2024 | proceng1
One trick that I use when I need additional paste for a larger part like a connector with thick leads is KAPTON. I'll put a thin strip of Kapton on the board side of the stencil along the apertures where I need more paste. Kapton is about 2.5mils th
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
Electronics Forum | Thu Mar 04 07:35:38 EST 2010 | rajeshwara
Plz tell me Stencil Thickness ? Solder Paste ? Mesh Size ? Partcle size/type? Viscosity?
Electronics Forum | Thu Jul 20 05:04:30 EDT 2006 | bing007
We had a similar problem with gold contact pads. Cleanliness is paramount. If you are using foil tensioning system, wash the foil in a stencil wash before use as the cardboard cassettes may be contaminated. Be very careful when loading into a frame f
Electronics Forum | Fri May 17 17:57:10 EDT 2024 | yannick_herzog
Hello, We have problems with insufficient solder volume on a component. To solve this problem, we want to add more paste to the component. We have two options for this: 1. run a stencil with a step to achieve the required volume. 2. overprinting
Electronics Forum | Sat Mar 14 09:12:59 EDT 2009 | davef
First, there is no good justification for getting solder on gold fingers. Second, it is well known that solder on gold fingers is unacceptable. So, shipping boards with that condition indicates sloppy quality practices at your CM. Third, that being
Electronics Forum | Tue May 28 12:29:29 EDT 2024 | carl_p
Depends on the product & constraints your having to deal with. I've used the following in the past; Stepped Stencil, Overprint, Additional dispensing equipment after the print process & Solder pre forms
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
Electronics Forum | Sun Aug 23 20:24:59 EDT 1998 | Karlin
Hi, Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. We have rule out the possibility of not printing any solder paste there
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