Electronics Forum | Sun Aug 23 20:24:59 EDT 1998 | Karlin
Hi, Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. We have rule out the possibility of not printing any solder paste there
Electronics Forum | Tue May 21 07:46:58 EDT 2024 | tommy_magyar
Michal, Overprinting is the extension of the stencil aperture over the solder mask, to enable a bigger volume of solder paste on the pad, therefore bigger volume of the solder joint after reflow. https://youtu.be/WAIm-6BSaiQ?si=UMp9WSFal3vXFp8F as
Electronics Forum | Fri Dec 07 08:32:56 EST 2001 | scottdavies
I have used Multicore MP-100 and Heraeus F380 pastes for a while, and experienced very few dry joint problems. May be worth checking if the pad size and/or spacing are to the correct specification for the components. Check the date codes on the comp
Electronics Forum | Tue Jul 13 19:00:29 EDT 1999 | JohnW
| Hi All, | Does any one experienced the solder on gold finger after | reflow. Its about 5 to 8 mils diameter . | We'd clean the entire screen printer, mounter & reflow as well, | but doesn't help much. | | Mr Kong..... Solder on gold is a age old
Electronics Forum | Wed Jul 14 10:58:25 EDT 1999 | Upinder Singh
| | Hi All, | | Does any one experienced the solder on gold finger after | | reflow. Its about 5 to 8 mils diameter . | | We'd clean the entire screen printer, mounter & reflow as well, | | but doesn't help much. | | | | | Mr Kong..... | | Solder
Electronics Forum | Fri Jun 29 23:10:02 EDT 2001 | Danial
Thanx for the reply guys!! The problem happened on only one PBGA, the balls are eutectic and the paste volume height is at 5.96 mil min. The stencil opening has been increased to 30 mil which initially was 20 mil. You guys are right!! One probable
Electronics Forum | Wed Jul 14 11:36:56 EDT 1999 | Jimmy Strain
| | | Hi All, | | | Does any one experienced the solder on gold finger after | | | reflow. Its about 5 to 8 mils diameter . | | | We'd clean the entire screen printer, mounter & reflow as well, | | | but doesn't help much. | | | | | | | | Mr Kong..
Electronics Forum | Wed Nov 21 12:29:52 EST 2001 | mparker
Now that we know where you've been and what you wish to accomplish next, I can still give you some suggestions. 1. Get IPC-7912. Use it to evaluate your CM's. Especially if you have multiple contractors supplying like products. You will quickly see
Electronics Forum | Mon Aug 23 03:12:57 EDT 2010 | grahamcooper22
Possible route causes of bridging on fine pitch ICs are; too much paste (stencil aperture wrong), poor print quality (paste smudges during printing), pcb pads not flat depending on the solderable coating, paste has poor cold slump properties, too muc
Electronics Forum | Mon Aug 24 21:04:58 EDT 1998 | Karlin
| | Hi, | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | We have rule out the possibility of not printing any solder
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