Electronics Forum | Mon Aug 23 14:09:56 EDT 2010 | davef
Similar to Coop's comments, above ... Bridging: * Mis-placement: misplaced components, high placement force mushrooms paste * Too much paste: HASL thickness, lead finish, poor underside support, poor underside wipe frequency, printing with too lar
Electronics Forum | Tue Aug 25 08:51:16 EDT 1998 | Justin Medernach
| | | Hi, | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | We have rule out the possibility of not printing any
Electronics Forum | Sat Jul 16 07:46:17 EDT 2005 | davef
If you have a glob of epoxy on your board, it will be difficult to stencil you paste on that side. Dispensing paste may be a better choice.
Electronics Forum | Mon Nov 29 13:09:12 EST 1999 | Mike Konrad
There are three primary methods of stencil cleaning. � Hand Cleaning � Spray-In-Air Cleaning � Ultrasonic Cleaning Hand Cleaning: Hand cleaning involves the removal of solder paste or adhesives from stencils using a chemically saturated wipe and /
Electronics Forum | Wed Jul 17 12:07:48 EDT 2002 | dragonslayr
DaveF is correct in directing you to the archives. This problem type has been discussed many times, it is quite common. Questions to ask yourself and provide us with answers are: It always happens or random? All assemblies or just one? solder paste
Electronics Forum | Mon Aug 24 08:34:14 EDT 1998 | JUSTIN MEDERNACH
| Hi, | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | We have rule out the possibility of not printing any solder paste
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Sat May 29 13:53:18 EDT 2010 | jandon
MY500 minimum dot diameter is 0.33 mm (0.013”) so you still need stencil for smaller dots. You are liable to couple of jet printing solder paste manufacturer and there where I live, only official Mydata distributor can sell those solder pastes. Also
Electronics Forum | Wed Jul 17 02:32:13 EDT 2002 | computer
Hi, Anybody with a solution on solder balls on gold pad. I have tried the following a) Check cleanliness of solder paste printing area b) Clean stencils on 1 clean per 2 prints c) Use N2 on the reflow oven. Any other methods...
Electronics Forum | Fri Jun 09 08:17:07 EDT 2006 | amol_kane
did you look at the pad vs the stencil design? are you putting down enough solder paste on the pads? what are your reduction ratios for these packages?
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