Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson
| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are
Electronics Forum | Fri Nov 16 03:03:44 EST 2001 | madreindeer
John, I have seen process mixed technology in customer site.Now they dont use wave but they print paste through hole components.It is good and fast but it did take a time when they found a right paste to do that.Stencil is plastic and aprox.3mm(3000
Electronics Forum | Mon Aug 26 12:37:58 EDT 2013 | deanm
Your stencil printing process is probably the most critical process in SMT. The paste I'm using states the best environment is with a temperature of 20-25C and humidity of 35-60% RH. Your paste may vary. We've run down to 10-15% RH with no measurable
Electronics Forum | Tue Jul 25 14:30:04 EDT 2017 | emeto
Looks like you have a great wetting of your paste :). Once body has been in contact with molten solder, the package could suffer damages on the body(outside and inside) and on the circuitry inside. It is considered a defect. I have seen that before a
Electronics Forum | Wed Aug 07 01:41:27 EDT 2019 | orbitcoms
Hi I am having trouble getting solder bridges on TQFP-100 (0.5mm pitch) components. The boards are pasted on semi-auto printer using laser-cut 0.12mm stencil and SN63 NC257-2 T4 paste. The components are placed using Samsung CP40LV and tghen reflow
Electronics Forum | Mon Nov 19 20:09:48 EST 2001 | davef
Printing paste with an �approx. 3mm (3000um) thick� stencil!!! Shirley, you jest!!! Please help us understand this better.
Electronics Forum | Wed Mar 14 17:52:49 EST 2001 | davef
6 Work Life Test 6.1 Obtain a stencil with 15 to 20 rows of a series of 0.025 by 0.050 inch apertures spaced 0.050, 0.040, 0.025, 0.015, 0.010, 0.010, 0.025, 0.040, 0.050 inches apart. See Appendix 1. Source of supply: Metal Etching Technology.
Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon
As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin
Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy
Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your
Electronics Forum | Sun Sep 25 20:20:22 EDT 2011 | johnyq
We recently aquired an old MPM-AP25 stencil printer that printed paste with a large error (about .060 inches). I concluded camera alignment to be the cause but was surprised by the magnitude. I found the camera beam splitter prism misaligned and loos
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