Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Wed Mar 14 02:04:40 EST 2001 | pjc
zam, each paste mfg. has different "stencil life" times. check w/ your paste mfg's specification for stencil life. also, temp and humidity inside the printer's chamber effects "stencil life" time. we keep ours around 20C @ 50% RH. higher temps and l
Electronics Forum | Tue Dec 21 17:58:44 EST 1999 | Brian W.
When doing PIH processes, it is critical that you control the solder VOLUME, not the height. You must define the process, monitor it and control chart it to keep the paste volume consistent. You have do some careful engineering to determine how muc
Electronics Forum | Tue May 19 12:54:55 EDT 1998 | Richard Jackson
| We had a similar problem. But whenever the solder came from the screen printer the solder would wet to the gold fingers, with the help of residual flux. But the problem is balls, that I assume are not wetted to the gold fingers but instead are jus
Electronics Forum | Wed Jul 13 13:35:07 EDT 2005 | chunks
Maybe you stencil height measurement is being affected. Check your tactile sensor, it may be sticking due to paste or adhesive getting on it.
Electronics Forum | Mon Nov 26 15:30:35 EST 2001 | jhingtgen
To all, For the benefit of everyone there will be a session conducted at APEX on this topic. I have included the information that I pasted from the APEX website (http://www.goapex.org). ADHESIVE PRINTING Chris Marinelli, Loctite Tuesday, Janua
Electronics Forum | Fri May 20 08:04:30 EDT 2016 | milroy
Hi All I have a need to calculate the Aperture area in a stencil with in a very short time without going in to a CAD viewer. I need that when I insert solder paste file in to a certain software application and that application software calculate the
Electronics Forum | Tue Jun 27 10:51:42 EDT 2000 | Ioan
Hi Bill, there are a couple of things you should check. Most likely you have too much paste which is squashed at the insertion of the cap. - the paste height, around 7 mils should do. Too much paste will cause shorts under the cap at insertion which
Electronics Forum | Wed Mar 14 09:07:34 EST 2001 | blnorman
We just ran a study to try to determine this. We exposed the paste to 85% humidity to simulate worst case manufacturing. At various times we removed the paste from the chamber and tested it for tack, solder balling, wetting (copper coupon), and vis
Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson
| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are
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