Full Site - : paste smearing on stencil (Page 22 of 30)

Re: Lifted Leads on Fine pitch QFP's

Electronics Forum | Mon Apr 19 22:52:59 EDT 1999 | Dean

25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo

Re: Lifted Leads on Fine pitch QFP's

Electronics Forum | Tue Apr 20 23:18:48 EDT 1999 | KEVIN SIMPSON

25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 15:08:56 EST 2007 | jaimebc

Shy, You mentioned that you are using "dog bone" apertures for your chip components? It doesn't make sense to me. I thought that the "dog bone" was used for fine pitch devices, to keep the solder away from the center and avoid bridging. It doesn't

Solder flow thru via on pad

Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef

Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the

Re: Lifted Leads on Fine pitch QFP's

Electronics Forum | Wed Apr 21 02:53:33 EDT 1999 | Raul N.

25 PPM)! | | | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compe


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