Electronics Forum | Fri Nov 03 21:16:40 EDT 2023 | calebcsmt
Depending on the assemblies you're producing, I highly recommend 8.9HF from Indium for a low residue SAC305 alloy. We have been using this for years in our NC process and residues are very little, with appropriate stencil apertures and paste printing
Electronics Forum | Wed Aug 07 05:08:04 EDT 2002 | matherat
This sounds like it could be a SIPAD solid solder application. Bring the boards in with the solderpaste already on them in a flattened solid form. Then you could print glue on them without disturbing wet paste. 1.Print glue. (Might take a little
Electronics Forum | Fri Jan 05 12:17:31 EST 2007 | Cmiller
Our first pass yield across all our products is above 95% but we include anything that does not meet IPC standards. Probably 75% of our failures are not electrical. AOI is a great tool to get a consistent measure of your process. I dont know how anyo
Electronics Forum | Tue May 28 08:32:41 EDT 2013 | emeto
Hi Eric, your problem looks like a printing issue - if the part(or group of leads) missing solder is always the same. I would say you should check: 1. Stencil for any damage at this area 2. Squegee for damages 3. Adequate pin support un der the boa
Electronics Forum | Fri Jul 17 11:49:58 EDT 1998 | Justin Medernach
| My question is in regards to how exactly temperature and humidity affect the stencil printing process. If temperatures here at the plant in the summer are 70-73 degrees F. and relative humidity is 60-65%,to what extent will the results of the ste
Electronics Forum | Mon Jan 08 03:47:47 EST 2007 | tk380514
as someone had said before, check you stencil and have it redesigned. I design our stencils for my factory and have inproved quality in BGA , QFP and 0603 case sizes. we did have 1 prototype series that used 0403 chips btu we had brand new feeders an
Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect
OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du
Electronics Forum | Thu Mar 22 15:44:50 EST 2001 | pteerink
I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so my pass spec, although they are not pret
Electronics Forum | Thu Mar 22 15:45:20 EST 2001 | pteerink
I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so mine pass spec, although they are not pr
Electronics Forum | Wed Mar 21 20:40:28 EST 2001 | dblsixes
We are building a monster ... Dimensions are 10" x 7" ... 12 layers ... A Logic Assembly with a Power Supply all rolled into one ... The Power Supply is in one section of the board, the logic in the other section ... The Power Supply obviously has a
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