Electronics Forum | Wed Mar 21 20:40:28 EST 2001 | dblsixes
We are building a monster ... Dimensions are 10" x 7" ... 12 layers ... A Logic Assembly with a Power Supply all rolled into one ... The Power Supply is in one section of the board, the logic in the other section ... The Power Supply obviously has a
Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon
| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con
Electronics Forum | Thu Jan 04 17:04:43 EST 2007 | slthomas
99% good solder joints = 10000 ppm (defects per million opportunities). Having only built with 0603s I can't speak for a target but that still seems pretty harsh....with a 75/25 0805/0603 ratio at my last place of employment I think we were running
Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef
Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can
Electronics Forum | Tue Nov 02 08:36:51 EDT 2010 | rgduval
Michelle, Our experience with no-clean solder pastes has been that water washing a mis-print is a bad idea. We've found that DI water does not do a sufficient job removing the no-clean paste (the same goes for stencils). Instead, we have washed no
Electronics Forum | Mon Dec 30 12:55:37 EST 2019 | emeto
We saw your profile, which in my opinion looks alright based on the guideline from the vendor. Can you tell us more about the joints that you cleaned? Are they showing nice wetting and nice and shiny finish? How about your stencil thickness? From my
Electronics Forum | Mon May 12 13:55:19 EDT 2014 | hegemon
It sounds like a bit too much solder on the PWB, caused by too large a pad for the lead it will contain. In that case solder reduction is the way to move forward. What are the options there? 1. New stencil or stencils - (not desirable) 2. Increas
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