Electronics Forum | Mon May 12 12:58:07 EDT 2014 | emeto
Hello all, I have a diode(gold plated)on some assemblies that gives me a a hard time. The paste is wetting too good and climbs the lead of the component and touches the body which is a defect. I just wonder what if there is a way to heat the board e
Electronics Forum | Wed Apr 28 11:16:45 EDT 1999 | Steve Gregory
Hello all, I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area of th
Electronics Forum | Wed Apr 28 12:18:04 EDT 1999 | Scott McKee
| Hello all, | | I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area
Electronics Forum | Mon May 12 15:13:29 EDT 2014 | emeto
Thank you guys. As we are speaking I keep examine the problem and here is what I got so far. 1. I measured the temperatures on my profile and the lead is hotter than the board. The lead goes 12 seconds earlier than the pad and is taking the solder.
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Tue Nov 09 04:21:11 EST 2010 | bising
Hi SMT World, I am facing a technical challenge related to an SOIC 14lds with thermal pad on it's belly that needs to be soldered onto PCB, together with leads. It is a 50 per board, expected 80% solder load on every one. We have some units without
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
Electronics Forum | Wed Sep 27 13:45:35 EDT 2000 | Bill Schreiber
Dear Dreamsniper, A big hidden cost in any cleaning system is the cost of diminished production and rework. I assume you are cleaning the adhesive stencils manually since there is no equipment cost in your formula. Manual cleaning of adhesive sten
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
