Electronics Forum | Tue Jan 30 03:44:17 EST 2007 | frank63
Thank you for feedback and comment. We are trying this again, increasement of solder temp to reach 210-215 peak temp. This is also our norml guideline, but in the past the colleagues had observed problem with that PCB, so reduced it. I let you kno
Electronics Forum | Thu Jul 25 18:41:52 EDT 2019 | myke03o
Hi I have solved the issue. The component cracking are the big 1210, 0603 and 0402 capacitors. After studying and testing in many type of solder. The best to use is SnPb and the components are the key - there are component which will tend to expand
Electronics Forum | Fri Apr 14 17:48:32 EDT 2023 | tey422
Without get too deep. The biggest drawback of batch washer, you can't pack too many boards into same batch. If you are washer very larger boards, that's the bottleneck. If you are washing No-Clean board, then you wait even much longer, more than dou
Electronics Forum | Fri Mar 19 07:24:38 EST 1999 | John
| | | | Hi folks, | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and
Electronics Forum | Wed Aug 12 11:09:42 EDT 2015 | jvalverde
Hello, I have a problem with the solder paste process, I need a solder paste with no Start-up Time because We do not work 24 hours in the manufacturing process, we works only 8 hours a day and at the finish we need to store the paste in the refr
Electronics Forum | Mon Apr 09 20:13:01 EDT 2001 | davef
First, some people wait a lifetime for ... ;-) Second, how do you guys measure the stencil aperture clog? What do you think of the Magnaplancil from Fendelaz? It�s a double fyv-blue-green CO2 laser refract-defractometer. ;-) Third, do you really
Electronics Forum | Mon Jan 29 10:41:30 EST 2007 | aj
Rob, We have ran LF BGA's with Lead Paste in the past. We actually got a MicroSection Analysis carried out and a full report which approved the Process. We had peak Temp around 225oC- 230oC . Its a matter of running the Lead Process at its max and
Electronics Forum | Wed Mar 02 02:07:06 EST 2016 | mbass
3000 components per side and yes the actual print cycle is longer (13 minutes) against the DEK print stroke of 30 seconds. But overall the whole cycle time of set up etc is way less on the MY500. The ability of the machine to adjust volume of paste o
Electronics Forum | Wed Nov 09 10:30:26 EST 2016 | jbreit
You're right. It is BS. I should have said "the operators are only WILLING to remove so much paste manually." When I brought up my concerns about leftover paste with the powers that be, I was told in no ambiguous terms that the operators will no
Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef
We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste
