New Equipment | Test Equipment
The new AutoSIR2™ system represents a dramatic improvement over existing SIR test alternatives, and its shielded precision electronics allows state-of-the-art accuracy resistance measurements to be made up to 1014 ω. One AutoSIR chassis can hold bet
Electronics Forum | Tue Aug 23 09:53:05 EDT 2005 | davef
There's some good background information on SIR [surface insulation resistance] on the web. Here's an example: http://www.tracelabs.com/TechLibraryDoc.aspx?id=4 Look to IPC-9201 - Surface Insulation Resistance Handbook SIR readings vary with: * C
Electronics Forum | Tue Jul 04 02:31:55 EDT 2006 | Mustang
Calling for an input from the Experts our there. Our customer is questioning the cleanliness of the no-clean product that we produced for them. We were asked to clean the board (localised cleaning) after rework (IC need to be changed due to an up re
Industry News | 2017-02-07 15:46:59.0
The best technical conference paper of IPC APEX EXPO® 2017 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 14.
Industry News | 2017-02-09 08:35:06.0
FARNBOROUGH, UK ― February 2017 ― Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that its Chief Technology Officer Dr Chris Hunt will present the paper titled “SIR intercomparison to validate the use of fine pitch pattern” at the upcoming IPC APEX EXPO. The presentation will be held during the session titled “SIR/Flux Reliability” on Tuesday the 14th February between 15:30 – 17:00pm in location 4.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
) Branch or snowflake-like patterns of metal that grow on surfaces between conductors. It requires a chemical reaction capable of dissolving the metal into a solution of metal ions, which are then redeposited by electro-migration in the presence of an electromagnetic field
