New Equipment | Education/Training
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure
New Equipment | Solder Materials
We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications. We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liquid Fluxes have been a
Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir
Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma
Electronics Forum | Wed May 24 15:59:34 EDT 2006 | JohnM
I have a product with mixed in Pb free and Pb BGAs. I decide to use SnPb paste with Pb free reflow profile to make it work for both types of BGA. Do I have a reliability solder joint issue by using this method? How is your opinion on this case? Can
Used SMT Equipment | Soldering - Wave
Used, reconditioned, resurfaced and melonite coated for Pb Free wave solder process. Speedline , Electrovert, Lambda Wave, Ultra fill 22" nozzle and flow duct. Excellant condition. Complete and operational. FOB: Origin MN 55439
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Technical Library | 2007-05-31 19:05:55.0
This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder.
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | , | Production
Position Description: Wave Solder Operator Reports to: Production Manager Department: Manufacturing Job Description: Wave Solder Operator Responsibilities: � Operate wave-soldering machine. � Insure that established process c
SMTnet Express, October 17, 2013, Subscribers: 26325, Members: Companies: 13458, Users: 35281 Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging by L.C. Tsao; National Pingtung University of Science
Alternative Pb-Free Alloys Alternative Pb-Free Alloys While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/certifications-and-standards
. China RoHS Hazardous Waste Material Declaration Restriction of Hazardous Substances (RoHS) Top 产品名称 Part Name 有害物质及元素 Toxic or Hazardous Substances and Elements 铅 Lead (Pb) 汞 Mercury (Hg) 镉 Cadmium (Cd) 六价铬
GPD Global | https://www.gpd-global.com/co_website/pdf/dispense/Dispensing-Systems-and-Pumps-Overview.pdf
Fluid Dispensing Machines and Equipment Precision Dispensing Systems Dispensing Systems & Pumps www.gpd-global.com request@gpd-global.com Tel: +1.970.245.0408 Fax: +1.970.245.9674 611 Hollingsworth Street, Grand Junction, CO 81505 USA Precision Dispensing Systems request
.gif)
winsouce.jpg)