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EverythingPCB, the PCB Industries Product, Service and Resource Guide
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New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
PCB Manufacturing Equipment R12 PCB Manufacturing Equipment PCB Manufacturing Reflow Oven PCB Manufacturing Oven PCB Manufacturing Machine Name: SMT Reflow Oven Heating zones: 12 Heating method: Hot Air Usage: SMT Assembly line Product de
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Industry News | 2013-03-12 11:34:11.0
GPD Global has appointed Technical Resources Corporation (TRC) as its representative in Florida, Puerto Rico and the Caribbean.
Technical Library | 2016-11-30 15:53:15.0
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
LCD TV Motherboard SMT Production Line in Ecuador TV is now an indispensable household appliance in society. Although the mobile terminal has occupied a large number of people's time, the market for TV is still very large in the world. Unlock t
I.C.T SMT Process Fully Automatic SMT Line Among our customers, there are many security products manufacturers. Last time we introduced the Russian university project and purchased one SMT+DIP line from us to produce security products, such as ele
Events Calendar | Wed Jun 07 18:30:00 UTC 2023 - Wed Jun 07 18:30:00 UTC 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Career Center | Winnipeg, Manitoba Canada | Engineering,Research and Development
Senior PCB Design Guru Are you ready for change? Love to design Printed Circuit boards and want to work with a group that is described as 'progressive minded' and 'innovative'? With a company that continues to grow developing secure technology so
Career Center | Atlanta, Massachusetts USA | Sales/Marketing
Our client is the world leader in automated optical inspection (AOI) systems for use in the manufacture of printed circuit boards (PCB) and flat panel displays (FPD) and is a leader in imaging solutions for PCB production and in AOI systems for use i
Career Center | , Florida/ Any USA | Production
program and operate the Mydata and wave solder machines-assemble PCB's- hand solder-inspect-rework-de-soldering
Career Center | reston, Virginia USA | Engineering,Management,Production,Technical Support
NIGEL COOMBER (703 715 1075) email: ncoomber@yahoo.com OBJECTIVE: To contribute in a position of high responsibility for a progressive technically innovative company which can utilize a highly motivated professional with leading edge experience in a
SMTnet Express February 28, 2013, Subscribers: 26214, Members: Companies: 13305, Users: 34373 Effect of Cooling Rate on the Intermetallic Layer in Solder Joints While it has long been known that the Cu6Sn5 intermetallic that plays a critical role
SMTnet Express, January 10, 2019, Subscribers: 31,583, Companies: 10,684, Users: 25,588 An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications Credits: Koki Company LTD The electronics industry has
Heller Industries Inc. | https://hellerindustries.com/country/australia-new-zealand/
Heller Industries Reflow Oven, Curing Ovens, Australia New Zealand Home » Australia & New Zealand Heller Industries Network in Australia
| https://www.smtfactory.com/Industrial-Control-Key-Role-and-Innovative-Applications-in-the-SMT-Assembly-Equipment-Industry-id66764027.html
: Key Role and Innovative Applications in the SMT Assembly Equipment Industry Views: 0 Author: Site Editor Publish Time: 2023-07-27 Origin: Site Inquire Industrial Control
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