Electronics Forum | Thu Nov 28 20:37:40 EST 2002 | Dreamsniper
I'm in the process of generating work instructions for our stores and production process with regards to moisture sensitive devices.And I'm a bit confused. I found out that we have many TSOP's, QFP's and BGA parts in sealed bags that have not been op
Electronics Forum | Mon Sep 06 20:18:37 EDT 2004 | charly
hi, we are running high mixed low volume here, and i encounter many pcb delam after reflow issue. here some doubt need ur advise: 1. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? if i allow bare
Electronics Forum | Fri Jun 01 23:57:21 EDT 2012 | bwjm
HI Guys, i am facing similar issues with this BT resin material too. PCB specs are 4 layers, Nelco400013, same Tg and Td. My PCB delam after reflow. The PCB has both side mounted with SMDs. Initial mounting on the btm side after reflow, no delam. B
Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid
TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s
Electronics Forum | Wed May 03 16:37:10 EDT 2017 | charliedci
I don't believe there should be any issues with the HASL finish. The issue is how long on the shelf and is a bake out required to remove moisture from PCB, as in any FR4 PCB's that may have had time to absorb moisture.
Electronics Forum | Mon Jul 10 08:17:06 EDT 2017 | philc
Just a random thought, but we had an issue with having to replace faulty LED's on a PCB, and the solution turned out to be pre-baking the LED's prior to build. Just put them in an oven at 40C for 24 hours, then build. Result was zero defective LED's.
Electronics Forum | Thu Feb 15 21:09:45 EST 2007 | Stephen- SMT engineer trainee
1. Can anyone tell me about the water absorption(wt%) among different PCB((i) RoHS, (ii)non-RoHS, (iii) Halogen free)), I am currently facing the problems of PCB blisters after reflow process. 2. Also, please suggest the baking period/time among dif
Electronics Forum | Wed Aug 17 14:30:58 EDT 2005 | russ
I usually see this with mask that is not fully cured from the PCB shop. This probably agrees with the baking statement that you made.
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Fri Oct 19 00:37:43 EDT 2001 | ianchan
Hi, my guys did such solder paste deposits on PCB bareboards before, (before my physical join with my current company), approximately 2-3 years ago, for a small Lot run. What the PCB supplier did was to apply "block" shaped Sn/Pb paste alloy onto t
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
.png)
