Industry News | 2009-03-02 00:10:24.0
TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Tue Nov 19 02:59:24 EST 2002 | yngwie
Hi Experts out there, pls help me with the following matters. How important is the bare PCB baking ? What is the temperature for baking @ what RH ? What would be the impact for the ENTEK finished board should the baking is really necessary ? For t
Electronics Forum | Thu Nov 21 14:17:27 EST 2002 | MA/NY DDave
Hi I can't give you the answer for your question because I have too many questions and would have to know a lot more before I was comfortable giving any advice. I have done mass Baking of piles of PCB's as a needed evil when piles of boards were ex
Electronics Forum | Tue Jul 16 01:12:31 EDT 2002 | ppcbs
We find that baking PCB assemblies at 90 degrees C in a Blue M forced air oven is safe for most all PCB's that we have encountered over the past 12 years. We remove any external plactic hardware that may be attached to the assembly and also like to
Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef
Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe
Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg
What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often
Electronics Forum | Fri Nov 22 08:57:56 EST 2002 | davef
Q1: What do you mean by "if the board is manufactured properly"? A2: If the epoxy is noy cured prooperly, for instance, the copper will not be well attached to the glass. So, peel strength will be lower. Q2: I don't believe that the peel off/or lif
Electronics Forum | Wed Nov 20 21:04:15 EST 2002 | yngwie
Hi Dave, What do you mean by "if the board is manufactured properly". If the board is not manufactured properly, humidity will have an impact on the peel strength? Is that what you mean. How does the Humidity impacted the peel strength ? Thru' which
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
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