Electronics Forum | Wed Nov 28 18:24:05 EST 2001 | mparker
Back in the days when pots, skillets, etc. were made of cast iron, vegetable oils were used to "season" the iron to prevent rusting and also from the food sticking to the pot during cooking. It would be reasonable to believe that you could use the sa
Electronics Forum | Tue Jun 13 09:40:36 EDT 2006 | grantp
Hi, Your right guys, and we turned off the chip wave, and most of the problem went away. It looks much better, and we are getting a slight bridging on a USB connector at the front edge of the PCB and a little adhesion, but not any where as much as w
Electronics Forum | Wed Jun 29 16:28:06 EDT 2011 | rway
Let's be more specific. Why do you need to clean the boards? I assume it is for testing purposes, probe contact concerns and the like. This is the only economical reason I can think of to clean no-clean flux residue from your assemblies. Before y
Electronics Forum | Mon Aug 25 08:15:54 EDT 2014 | jax
With a melting point of roughly 300°C, you would need to have the product see temperatures peaking around 325°C at a minimum. (I would make sure the components and PCB materials can withstand these temperatures) Most convection ovens do not go over 3
Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker
Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a
Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
Electronics Forum | Wed Jan 26 13:10:50 EST 2005 | jbrower
Tom, has your company started to convert your BOMS? How is your company doing it? Yes, I think that is on most peoples minds, how to do the BOM conversions is the main worry, and I think that it just boggs some companies down so they dont do anyt
Electronics Forum | Wed Sep 02 08:52:13 EDT 1998 | Justin Medernach
| | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | Our pad design is .020" diameter pads with .025" solder resist diameter. Th
Electronics Forum | Tue Jun 08 17:52:53 EDT 1999 | Chrys Shea
| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s
Electronics Forum | Mon Jan 28 08:07:44 EST 2002 | JohnW
Sorry I keep forgetting you lot are backwards in the old metric system :0) anyhoo, yes IPC, the bastions of right well as long as your board is only 1.6mm thick (sorry 62mils)say that you need 75% min general and 50% on ground planes. I'd like to se
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