Electronics Forum | Tue Dec 18 21:05:26 EST 2007 | ludee_circuits
What kind of ceramic PCBs you need? Please offer more details. We could make PCB using RO4003 and 4350B materials.If there is anything I could do for you,please send me a email : kobe@ludeecircuits.com
Electronics Forum | Thu Aug 09 16:41:12 EDT 2001 | johnw
Dave , you know it's your cheery disposoition I love.... Ok so the process: Process is Double sided reflow for SMT & PTH via the wave. Like I said or did I, I forget and can't check back...it's a spray fluxer with noclean mutlicore NR3s-06 water b
Electronics Forum | Wed Feb 25 08:34:00 EST 1998 | Earl Moon
CERAMIC CIRCUITRY Starting with hybrid thick film circuits in 1965 at Sperry Flight Systems, I have been involved with ceramics (usually aluminum oxide) as the substrate material. Then, we developed "multilayer" circuitry (replacing "cordwood" module
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Sat Mar 06 08:01:45 EST 1999 | Scott Cook
| Can someone please advise me to the rework procedure for removal and replacing Ceramic Chip Capacitors (e.g. 0805, 1206, etc.)? | | Is it necessary to pre-heat ceramic capacitors before soldering them onto a PCB with a soldering iron? Is this just
Electronics Forum | Thu Aug 31 10:38:24 EDT 2017 | jchris
Thanks for all of your suggestions. I ended up borrowing a Pace Worldwide PH100 Preheater, which worked like a charm. I'm in the process of purchasing one for our own shop. I had to place the aluminum pcb directly onto the PH100's ceramic heating pla
Electronics Forum | Wed Apr 09 14:50:03 EDT 2008 | bradlanger
We use a FKN pizza cutter and found that even with 5mm clearance and the proper orientation of the part larger ceramic capacitors 1812, 1210 would still stress fracture. We have successfully fixed stress fracture problems by adding routed relief slot
Electronics Forum | Wed Aug 08 21:18:15 EDT 2001 | davef
Get-out the razor blades, bud. You could run that sukka for 6 sec dwell, cook breakfast on it, and you still will not get fill. [Hole file that is, breakfast will go along ways if peckish, though.] You could fire-up the depleted ozone rework gun [
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Wed Sep 07 10:34:52 EDT 2005 | PWH
Have experienced this on a few different cap. parts. Agree with other postings. Following are solutions to problems we have had: 1) Cracked cap too close to board edge per IPC spec. Designer replaced part with 3 caps in series to eleviate stress
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
