Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Industry Directory | Standards Setting / Certification / Training Provider / Consultant / Service Provider / Manufacturer
BEST is a certified master IPC Training and Solder Certification center. We provide comprehensive courses for both Instructors and Operators including IPC-A-610, IPC J-STD-001, IPC-A-600, IPC/WHMA-A-620, and IPC 7711/7721 standard
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2016-12-09 23:33:42.0
GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Technical Library | 2025-08-29 13:53:05.0
In electronics manufacturing, "underfill" refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Nano-copper sintering in formic acid vapor.
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Events Calendar | Sun Jun 07 18:30:00 UTC 2020 - Sun Jun 07 18:30:00 UTC 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Mon Mar 29 18:30:00 UTC 2021 - Mon Mar 29 18:30:00 UTC 2021 | ,
Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials
Career Center | Durham, Connecticut USA | Production
ELECTRONICS - Connecticut contract electronics manufacturing company is accepting applications for printed circuit board assemblers and inspectors for full- and part-time work. We offer competitive compensation & benefits and maintain a very clean,
Career Center | Burnet, Texas USA | Sales/Marketing
Austin American Technology is seeking Independent Manufacturers Representation for our Arizona and New Mexico territory. AAT is looking for a representative organization with complementary lines of capital equipment that would like to add the world
Career Center | Juneau, Wisconsin USA | Engineering,Management,Production,Quality Control
DAVID A BOND N5116 Sinissippi Point Road ? Juneau, Wisconsin 53039 ? (920) 349-3094 ? E-mail: tex007@charter.net SUMMARY A professional, results-oriented Product and Process Engineer with extensive experience in manufacturing. Proven s
Career Center | reston, Virginia USA | Engineering,Management,Production,Technical Support
NIGEL COOMBER (703 715 1075) email: ncoomber@yahoo.com OBJECTIVE: To contribute in a position of high responsibility for a progressive technically innovative company which can utilize a highly motivated professional with leading edge experience in a
applications are becoming more common. There are
SMTnet Express, October 7, 2021, Subscribers: 26,641, Companies: 11,452, Users: 26,882 Cleaning Before Conformal Coating Cleaning PCBs before conformal coating removes potentially harmful and unknown contaminants from the board
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_board_cleaning.html
SMT & PCB Equipment, Board Cleaning SMT & PCB Equipment - Board Cleaning Aqueous Technologies PCB Batch Cleaner Full Information SOLD Aqueous Technologies PCB Batch Cleaner SMT600- CL Closed Loop System New - Never Used - Year 12/2007 Save over 50% off
| https://www.eptac.com/ask/no-clean-flux-application-and-cleaning/
No Clean Flux Application and Cleaning - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
