Industry News | 2011-08-01 16:08:33.0
Practical Components has added additional test boards and kits for testing for process cleanliness and conformal coating.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Industry News | 2008-03-12 16:21:20.0
Rancho Cucamonga, CA - March 2008 � Aqueous Technologies Corp. announces that it will exhibit the C3 Cleanliness Tester in booth 2431 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, 2008 in Las Vegas.
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
Industry News | 2008-03-20 15:46:19.0
Essemtec will display SP200-AV, a fine-pitch printer with automatic vision adjustment, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2010-06-21 14:24:32.0
RANCHO CUCAMONGA, CA — Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, introduces the Trident OneShot automatic defluxing and cleanliness testing system. Trident OneShot is designed to provide automatic cleaning (de-fluxing), cleanliness testing, and drying of post-reflow circuit assemblies. The system provides the same cleaning, cleanliness testing, and drying performance of the multi-award winning Trident III Series at almost half of the cost.
Industry News | 2015-04-07 17:14:44.0
KYZEN announces that David Lober presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Lober presented “Improving Device Reliability When Building Highly Dense Assemblies.” For more than 25 years KYZEN consistently has delivered leading science connected to care in order to persistently create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. Mr. Lober is part of KYZEN’s innovative new product technology team.
Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi
Industry News | 2011-11-01 10:52:43.0
Aqueous Technologies announces the upcoming 30th anniversary of the Zero-Ion Ionic Contamination (cleanliness) Tester.
Industry News | 2014-04-17 17:54:25.0
Aqueous Technologies introduces the newest model in the Trident family of fully automatic cleaning/defluxing systems – Trident ZDO. Trident ZDO is completely zero discharge, automatically washes, rinses, verifies cleanliness, and fully dries assemblies within a single compact machine.
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
