Electronics Forum | Wed Jun 23 08:47:32 EDT 2010 | mun4o
Hi, about location - components are in the diferent location on PCB.In the one PCB have 7 cap 560pF 0603 , and some of thenm are cracked, another are OK. When I look at 20x microscope , I can't see defect, but ICT measure from 200 to 350pf.When hea
Electronics Forum | Mon Jul 12 00:23:02 EDT 2010 | leadthree
I had cracking caps from the ICT and a variation in the length of the probes (due to wear and tear) that press down the PCB. That put lots of mechanical stress on the PCB. So have also a close look at the ICT, or another other test fixtures you use.
Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f
Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee
Electronics Forum | Wed Jun 13 16:13:54 EDT 2001 | Igmar
Have anyone seen this problem: Capacitors (100nF 0805) placed on PCB and then appear cracked after reflow. After reflow, the solder joints look visualy acceptable. Then capacitors fail during testing. When attempting to remove capacitor with hot sol
Electronics Forum | Wed Feb 20 23:17:34 EST 2002 | surachai
I AM JUST EVALUATION LEAD FREE EVALUATION AND FOUND THE BIG PROBLEM OF SOLDER CRACK BETWEEN TERMINAL OF COMPONENT AND THE INTERMETALLIC LAYER OF LEAD FREE ALLOY BUT DON'T FIND ANY CRACK BETWEEN SOLDER AND SURFACE OF PCB , COULD YOU HELP ME VERIFY T
Electronics Forum | Sun May 26 02:06:39 EDT 2019 | jlawson
Placement force can cause chip cracking-micro cracks also. As machines are getting faster they tend to not control force other than spring pressures and z displacements. There are some machines that have full closed loop place pressure control , but
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Fri Jun 20 10:27:19 EDT 2003 | Cristiano Dick Smiderle
Hi We are experiencing serious problem with ceramic capacitors. They are with low electrical resistence and the problem is intermittent. We found some of them with micro cracks but not all. What could be the causes for this problem? We are su
Electronics Forum | Wed Jul 02 18:39:22 EDT 2003 | Jim Yutzie
The vast majority of issues I have seen are from depaneling with a PCB seperator. Try placing a row of tightly spaced unplated holes adjacent to the edge that the crack parts are being found out (assuming they are within .5" or so of the score line)
Electronics Forum | Tue Aug 10 12:51:59 EDT 2004 | robert.barr@xensor.com
WE CAN'T SEEM TO FIND A BOARD HOUSE THAT CAN SEPERATE OUR PCB ASSEMBLIES WITHOUT CRACKING COMPONENTS. BEEN THROUGH TWELVE OF THEM. IS IT OUR PROBLEM OR IS ANYBODY ELSE HAVING ANY TROUBLE WITH THIS.
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