Electronics Forum | Wed Jul 02 18:39:22 EDT 2003 | Jim Yutzie
The vast majority of issues I have seen are from depaneling with a PCB seperator. Try placing a row of tightly spaced unplated holes adjacent to the edge that the crack parts are being found out (assuming they are within .5" or so of the score line)
Electronics Forum | Tue Aug 10 12:51:59 EDT 2004 | robert.barr@xensor.com
WE CAN'T SEEM TO FIND A BOARD HOUSE THAT CAN SEPERATE OUR PCB ASSEMBLIES WITHOUT CRACKING COMPONENTS. BEEN THROUGH TWELVE OF THEM. IS IT OUR PROBLEM OR IS ANYBODY ELSE HAVING ANY TROUBLE WITH THIS.
Electronics Forum | Wed Aug 08 17:50:22 EDT 2007 | flipit
X7R >Z5U,Y5V Greater means less likely to crack or in other words NP0 is better than X7R for crack resistance. Don't think that there is a set formula. There isn't! I cracked ceramic resonators at 0.050" from the board edge with CAB M2 and M3 dep
Electronics Forum | Thu Mar 08 05:49:11 EST 2001 | Dreamsniper
Hi, We are encountering a shortage on our parts and our purchasing said that the parts, which is in PLCC packaging, is hard to order from the local and international market and we can only get them in QFP packaging. Now the problem enters here. Our P
Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63
Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens
Electronics Forum | Fri Nov 16 03:23:15 EST 2007 | jwsmt
I'm requesting assistance in developing detection and containment methods for an issue with an SMD ceramic resonator (Murata CSTCE-G-A family). The returns have external visual cracks that originate at the termination and run at approximately a 45 d
Electronics Forum | Thu Mar 14 09:07:26 EST 2002 | cfraser
I can not tell you what the actual stress limits are. I can tell you that de-paneling PCB's by hand is a very poor choice. I have seen numerous accounts of cracked caps, resistors, and LED�s due to incorrect de-paneling procedures. I would recommend
Electronics Forum | Tue Mar 25 14:05:16 EDT 2008 | flipit
X7R >Z5U,Y5V. Y5Vs crack more than NPOs. Ceramic resonators crack often as well. I found that the chop style like the Fancord VPD5 is the lease stressful of the V-Score cutters. We have run as close as 0.025" to the edges with 0805s with no crack
Electronics Forum | Fri Sep 04 02:27:48 EDT 2009 | hurr
Hallo all, when I remove one from us malfunction BGAs from PCB I saw under X-ray inspection inner hairline crack.(see fig.1.) BGA was dried according to J-STD 033 and reflowed in lead process. When I look at new (baked BGA) under X-Ray inspection I
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