Electronics Forum | Thu Sep 07 08:50:45 EDT 2006 | Grant
Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has cracked off the PCB. It's below the intermetalic layer in the ball. Reflow otherwise looks good, and the raw components are clean. I am wondering what c
Electronics Forum | Tue Mar 18 12:38:39 EDT 2008 | fsw
Hi! Can anyone tell me what is the min spacing between PCB edge & land pattern to avoid cracking of components due to mechanical stresses caused while depaneling with cookie/pizza cutter. Thnx!
Electronics Forum | Wed Sep 27 17:24:08 EDT 2000 | Wolfgang Busko
Ashok: Plating thickness and ductility of the copper are things to look for. If it�s a crack where two layers are pressed together one possible cause could be bad process parameters while pressing these layers together at the PCB shop with the resul
Electronics Forum | Tue Jul 09 22:12:03 EDT 2019 | eddy2019
The price increase of electronic components such as MLCC has not stopped. In recent years, driven by the development of electric vehicles, industrial control and other industries, the demand for MLCC products has increased rapidly. However, the overa
Electronics Forum | Fri Dec 08 23:02:24 EST 2000 | LeeKibler
Beware the foam fluxer. I had a problem with cracked caps that just about drove me off the deep end. I discovered that my foam fluxer air knife was not turned on resulting in excessive flux. The excessive flux (VOC free) was not properly dried off
Electronics Forum | Wed Feb 02 20:53:34 EST 2000 | Dave F
Dennis: Several points: 1 If you're talking AlphaLevel process (?): � Good solderability, as HASL, even no-cleans bite well. � Planarity, uniform deposit, no bridgin� of FP. � Doesn't store as well as NiAu ... LT 6 months sealed � Very sensitive t
Electronics Forum | Mon Nov 23 19:20:18 EST 1998 | Kevin
A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioning
Electronics Forum | Tue Jul 22 03:56:24 EDT 2003 | A.G.
Are there existing acceptability dedicated criteria for ALIVH bare boards? (Equivalent to IPC-A-600) In particular, how can we assess copper foil cracking after thermal stress?
Electronics Forum | Wed Apr 13 08:56:39 EDT 2005 | Dhanish
Hi, I need help as we are seeing high defect on label peeling off which is attached on the PCB.After remove the liner on the Lexan label,we realize there is crack in the adhesive and base materialPlease advise what test can be done to ensure there is
Electronics Forum | Sat Nov 04 19:48:15 EST 2006 | Dhanish
Can someone educate me what is 1)glass wicking failure on PCB 2)Crack of TH Barrel How it happens and how this can be rosolved?
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