Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill
What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.
Electronics Forum | Fri May 04 02:17:48 EDT 2007 | clusogreg
Are you sure the BGA is not Leadfree and the proces you are using is a leaded process? If so then the Balls will not reflow and there will be cracking. Likewise the other way around
Electronics Forum | Tue Aug 25 13:30:35 EDT 2009 | rossi
It appears that the crack is between the paste and the ball. We physically pulled off the BGA by force and almost all the balls broke at the PCB. There was a thin layer of solder left on the pad. Maybe 1% of the balls stuck to the pad. I have attac
Electronics Forum | Mon Jul 12 00:20:11 EDT 2010 | leadthree
After a detailed check the cracking was most likely from the ICT and a variation in the length of the probes (due to wear and tear) that press down the PCB. I am very certain that was the reason.
Electronics Forum | Wed Jul 13 11:59:06 EDT 2016 | emeto
Moisture before reflow is consideration, because damages parts and boards in the reflow process. It is all about this water expanding as gas and cracks part or causes PCB delamination. Moisture after reflow is still affecting the work of the product
Electronics Forum | Tue Nov 24 11:13:11 EST 1998 | Keith
| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni
Electronics Forum | Tue Jul 22 09:05:14 EDT 2003 | davef
Any-Layer Interstitial [Inner] Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve
Electronics Forum | Wed Mar 17 19:41:15 EST 2004 | Dreamsniper
I'm hit with the above problem and found out that the BGA's themselves have fibres on their solder balls. I have soldered some without having the knowledge of the above fibres and found that the fibres are caught between the PCB pad and the BGA solde
Electronics Forum | Wed Aug 26 03:21:00 EDT 2009 | sergey2007
Hi Graham, the MSD level of the component is 3. I am not sure that my customer properly stored the component before the soldering process. And I am not sure that it was dried at all. The customer says they did everything that they had to, but I just
Electronics Forum | Fri Apr 16 11:36:33 EDT 2010 | fönsi
Thank you for the links. I didn't know that there are companys that build test systems for ultrasonic inspection. My idea was to use a ultrasonic detector similar to crack inspection, for example to detect if the cooling pad is melted, or a solder jo
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