Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2019-07-25 07:53:37.0
The Trump administration today is recognizing IPC member Calumet Electronics in Calumet, Michigan, for its efforts to expand its skilled workforce.
Industry Directory | Manufacturer
NEW Thermally Managed, CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
Industry Directory | Manufacturer
NEW Thermally Managed, CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
Technical Library | 2008-11-13 00:06:32.0
The electronics industry is facing issues with hot spots, solder joint stresses and Coefficient of Thermal Expansion (CTE) mismatch between PCB and IC substrate. Flip chip type packages for example have very low CTE compared to traditional PCB material. Thus it is necessary to have low CTE printed circuit boards in order to keep solder joint intact with such low CTE packages. There are currently several materials available in the market to address thermal and CTE challenges but each material has its own advantages and limitations...
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg170, Lead-free, Low Z-axis CTE, Low water absorption. 2). Excellent thermal stability and anti-CAF performance 3). 2-30 layer, 1.6mm thick 4). 1 oz copper finished 5). 10% impedance control 6). Immersion gold, HASL LF. 7). Suitable for hig
Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
Technical Library | 2008-02-04 12:13:38.0
Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.
Technical Library | 2020-01-01 17:06:52.0
The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials.CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a "board level" CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating.
Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the followin
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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