Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef
Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can
Electronics Forum | Tue Jun 25 01:24:25 EDT 2019 | sssamw
That is possibley CTE mismatch between QFN and PCB material, the thicker PCB the higher fail rate.
Electronics Forum | Wed Jun 29 17:38:16 EDT 2005 | GS
Several years ago, we had almost same pbm, best results have been obtained by using water soluble paste (those time the old AM1208). Any way, to get a good toe meniscus is not so easy. Talking about CTE, keep in consideration the internal die of TSO
Electronics Forum | Thu Jul 12 20:20:31 EDT 2007 | seankim10
I�m having problem with PCB with 16mil thickness due to warpage. the board convex up in the middle after 1st reflow. It seams the warpage is caused by CTE mismatch between PCB and multiple TSOP's, which are covering ~80% of the bottom side board area
Electronics Forum | Mon Aug 06 17:29:07 EDT 2007 | gsala
Hi Gents, I heard people having concernes by using 2512R SMD resistors due to potential solder joint reliability defect(CTE mismach among ceramic/alumina+solder+PCB) when soldered by lead free alloys (SAC like). Any experience/news about solder j
Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak
Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Fri Mar 19 12:22:36 EDT 2010 | stepheniii
Could it be a CTE mismatch issue?
Electronics Forum | Fri Nov 16 03:23:15 EST 2007 | jwsmt
I'm requesting assistance in developing detection and containment methods for an issue with an SMD ceramic resonator (Murata CSTCE-G-A family). The returns have external visual cracks that originate at the termination and run at approximately a 45 d
Electronics Forum | Thu Aug 17 22:22:29 EDT 2000 | C.J. Long
Hi erverybody: I am from a PCB shop. One of our product is with 19 X 19 ceramic BGA and my customer is experiencing 0.1 - 04 % failure of open trace on cornoer BGA pad. Substrate is FR4 with TG 135 degree C and delta Tg is well below 3 degree C. Tra
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
