Electronics Forum | Thu Jun 25 15:33:51 EDT 1998 | Earl Moon
| | Hi there, | | Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? | | | | Appreciated for your help. | | rgs, | | chiakl | Chiakl, | It looks like you are speaki
Electronics Forum | Thu Dec 10 03:37:29 EST 1998 | Youngho Song
Hi everybody? I heard that typical FR-4 would not acceptable for BGA application. What is the main reason? (thermal property? or CTE?) Sombody please answer me the requirement of PCB substrate for PCB application. Thanks. Youngho Song
Electronics Forum | Thu Jun 04 02:16:43 EDT 2020 | SMTA-Robert
Looking for CTE and young's modulus values for aluminum backed PCB for solder joint predictions. The data sheets are a bit sparse, and the weighted average method somehow doesn't feel appropriate. Any advice is welcome. Thanks!
Electronics Forum | Wed Jun 24 15:16:51 EDT 2020 | SMTA-Dave
The typical CTE below Tg is 40 ppm/K and 110 above Tg ppm/K. The typical modulus is 16 Gpa
Electronics Forum | Sat Nov 03 05:41:07 EST 2001 | Ben
Hi Could somesomeone help to let me know can bare PCB (FR4) is damaged by thermal shock? Can difference of CTE from copper or solder to FR4 damage PCB from apply heat too fast? Any specification or standard can i refer? Thank you Ben
Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78
I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m
Electronics Forum | Sun Jan 19 10:25:54 EST 2003 | davef
You shouldn't freak. You want the pads on both sides of the BGA ball the same so that the torgue from changes in dimension due to different CTE [ie, interposer, solder, bare board, etc.] is balanced on the top and the bottom of the ball. So, the ma
Electronics Forum | Fri Feb 13 09:17:11 EST 2004 | Kris
we are worried about the coating not being able to cover underneath the BGA. If the coat is excessive then it would cause CTE issues. Also if anybody has data on 85/85, 1000 hrs after conformal coating of BGA, would appreciate if you guys can share
Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F
Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast
Electronics Forum | Wed Oct 29 06:17:45 EDT 2014 | julianf
As stated in the title I would like to know the thermo-elastic material properties, most preferably the E-modulus and CTE in x- and y-direction, for Epoxy/E-glass laminates and/or prepregs for various fibreglass cloth styles. Datasheets only give ro
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