Electronics Forum | Wed Oct 29 06:17:45 EDT 2014 | julianf
As stated in the title I would like to know the thermo-elastic material properties, most preferably the E-modulus and CTE in x- and y-direction, for Epoxy/E-glass laminates and/or prepregs for various fibreglass cloth styles. Datasheets only give ro
Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon
| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son
Electronics Forum | Wed Sep 01 14:31:22 EDT 1999 | Dave F
| To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has any
Electronics Forum | Wed Sep 15 17:31:40 EDT 2004 | GS
Once you verified for correct profile ( consider CTE mismatch) make sure before you remove PBA from fixture, the temperature is almost at room temperature. If by removing PBA from fixture,and the PBA gets a little bent (warped) just in the area where
Electronics Forum | Thu Nov 05 13:38:43 EST 2009 | davef
Martin It might be possible to mount a deballed BGA as you mount a QFN. Thinking about doing it, it could be a lot more difficult than first thought. When you heat a BGA, it 'dances' on the board because of the different CTE of the materials involved
Electronics Forum | Wed Nov 16 21:35:07 EST 2022 | stephendo
" so I wander what can I do to save them?" The boards or management? Seriously I think this is more of a management issue than a technical issue. We can suggest what to do but if management does not accept that solution then it won't work. I'm not s
Electronics Forum | Fri Sep 15 16:37:49 EDT 2000 | Dave F
Sounds like someone aimin� fo tha big hurt, if ya axes me. Two spots to place your lawn darts are: 1 J Hwang in "Modern Solder Technology � " states (p.354) that " � extreme CTE mismatch between silicon IC (~2) and the PCB (~16), solder connections
Electronics Forum | Sat Jul 03 10:03:22 EDT 2004 | Bryan Sherh
Things to consider are: * Thermal expansion > characteristics of you flex and your pallet > should be better matched. We use G-10. * > Placement of your two sided tape should be > better, more uniformly distributed. We run strips > the length o
Electronics Forum | Thu Sep 02 04:26:02 EDT 1999 | Wolfgang Busko
| | To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has a
Electronics Forum | Tue Nov 14 04:52:57 EST 2006 | Loco
To make it even more compicated, you have CTE before Tg and after Tg, altough the after Tg is way more important, because the expantion ratio will be much bigger, a pcb supplier will usually give the before Tg value. To come back to the delamination
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