Electronics Forum | Fri Jul 29 19:12:30 EDT 2005 | Jason Fullerton
In the true sense of the term, tombstoning can only occur during reflow. Now, if your solder joints are cracking during thermal cycling and opening on one end you still have a problem - it just isn't "tombstoning". What laminate are you using on yo
Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip
Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter
Electronics Forum | Thu Sep 02 11:47:55 EDT 1999 | ScottM
| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea
Electronics Forum | Fri Oct 26 17:01:52 EDT 2001 | davef
We process no Teflon boards. Companies, such as Rogers and Taconic, make laminates of Polytetrafluoroethylene [PTFE] er �Teflon�. Common �Teflon� laminates are: * Woven glass / PTFE * Random microfiber glass / PTFE * Ceramic / PTFE * Woven glass /
Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef
What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a
Electronics Forum | Thu Apr 03 11:57:38 EST 2003 | davef
R4: We see the ball left on the PCB with a flat top and the BGA pad appears to be virgin. D4: Not good. The flat top indicates that the ball melted at one time or another. This pad and ball have seen at least two solder cycles with solder and flux. S
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