Parts & Supplies | SMT Equipment
03023054-03 Barcode Laminate X-Feeder Sector 1 03023073-03 BarcodeLaminate X-Feeder Sector 3 03023618-01 SOKO Nozzle 7xx for A 5x2/a 3,8x0.8 03023746-04 machinery facing X-F MTC r 03023750S01 Slider 03023777-02 FEEDER SEALING /X-SERIES
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: FUJI Model: H3022T Part Name: Filter Used For: SMT Machine Leadtime: Within 1~2days Condition: New Original New SMC Filter Elements , SMT FUJI XP243 Filter H3022T Specifications Brand Part Name Model lead
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: DEK Part Name: Board Clamp Part Number: 215607/ 137516 / 5157438 Long: 500mm Used: For DEK Printer Origin: China DEK 215607 / 137516/5157438 Board Clamp 500mm For DEK Screen Printing Machine Information:
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: DEK Model: 122022 Part Name: Transport Belt Used For: Printer Machine Leadtime: Within 1~2days Condition: New SMT Screen Printing Machine Parts 3mm Single Joined DEK Transport Belt 122022 Specifications Bra
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: DEK Model: 137516 Part Name: Board Clamp Used For: Printer Machine Leadtime: Within 1~2days Condition: New Professional DEK Board Clamp 137516 D-5157438 DEK Spare Parts Specifications Brand Part Name Mode
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Parts & Supplies | Visual Inspection
DEK SMT Printer Squeegee holder with blades 170mm to 700mm Screen Printer 129924 170mm metal squeegee blade 129925 200mm metal squeegee blade 133584 250mm metal squeegee blade 133585 300mm metal squeegee blade 129926 350mm metal squee
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
New Equipment | Education/Training
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
Industry News | 2012-04-03 13:40:03.0
— IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2013 IPC APEX EXPO® at the San Diego Convention Center in San Diego, Calif.
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830