Industry News | 2021-03-25 16:07:44.0
Contract Manufacturer Wildtrax proves that some businesses have reasons to pursue aggressive growth strategies even in times of global challenges. The Littlehampton-based CEM invested in its second SMT pick & place machine from Europlacer during the lockdown in September 2020 to support the urgent manufacture of equipment destined for several essential key markets, including assemblies for vaccine machines, cold-chain distribution products and the Nightingale Hospital.
Industry News | 2021-08-23 19:46:25.0
PENANG MALAYSIA - August 2021 - ViTrox Technologies, the world's most trusted technology company for the semiconductor and electronic packaging industries, announces its participation in the SEMICON SEA 2021 Virtual Exhibition from 23rd to 27th August 2021.
Industry News | 2022-05-05 17:10:49.0
SMTconnect, which will take place from 10-12 May in Nuremberg offers a highly relevant program for visitors to the exhibition. With important exhibitors in the industry showcasing their latest developments, the fair provides an opportunity to connect, create and drive technology.
Industry News | 2023-10-16 12:48:01.0
Atlanta, Georgia – Koh Young Technology, the leader in True3D™ measurement-based inspection solutions changed the industry over 20-years ago with its multi-projection solder paste inspection machine. The electronics manufacturing industry quickly adopted the patented technology, which is now the de facto standard SPI machine in the market. On 30 October during the SMTA Tampa Bay Technical Forum, Ray Welch, Senior Applications Engineer at Koh Young will discuss the growing importance of SPI as a process improvement tool.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2022-01-23 21:57:02.0
PENANG MALAYSIA - JANUARY 2022 - ViTrox aims to be the World's Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions for the semiconductor and electronic packaging industries, announced that it will be participating in the IPC APEX Expo 2022, scheduled to take place at the San Diego Convention Center, in San Diego, CA, from January 25 - 27, 2022. We would like to invite you to visit our Booth#2909 to discover the new products that will be launched under the full spectrum of ViTrox PCB SMT Assembly Inspection Solutions.
Industry News | 2011-03-02 17:28:40.0
Essemtec announces that it will feature a range of new equipment in Booth #773 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2021-10-15 01:50:26.0
HAYWARD, CALIFORNIA - OCTOBER 2021 ViTrox Americas, Inc., a wholly-owned subsidiary of ViTrox Corporation Berhad, the World's Most Trusted Machine Vision Inspection Solutions for the semiconductor and electronics packaging industries, is pleased to announce the appointment of Torenko and Associates as one of its Sales Channel Partners (SCPs) to cater its increasing customer base in the U.S. region.
Industry News | 2021-10-15 01:50:27.0
HAYWARD, CALIFORNIA - OCTOBER 2021 ViTrox Americas, Inc., a wholly-owned subsidiary of ViTrox Corporation Berhad, the World's Most Trusted Machine Vision Inspection Solutions for the semiconductor and electronics packaging industries, is pleased to announce the appointment of Torenko and Associates as one of its Sales Channel Partners (SCPs) to cater its increasing customer base in the U.S. region.
Industry News | 2010-03-24 13:19:39.0
Glassboro, NJ — Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will feature a range of new equipment in booth 1059 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
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