Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
Industry News | 2019-08-08 08:16:10.0
KIC today announced plans to exhibit in Booth 1C01 at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0
Industry News | 2019-01-31 19:51:12.0
Seika Machinery,announces the company’s 25th year in business. The company celebrated the milestone with an appreciation dinner for its employees and representatives during the IPC APEX EXPO.
Technical Library | 2014-08-19 15:39:13.0
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come.
Industry News | 2018-09-18 20:19:23.0
SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2016-03-15 16:08:12.0
Seika Machinery announces that it was awarded two 2016 NPI Awards during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center during the IPC APEX EXPO. Seika won for the following categories: Cleaning equipment for the Unitech UC-250M-CV Board Cleaner and Process Control Tools for the Malcomtech RCX Series Modular Reflow Oven Profiling System.
Industry News | 2011-03-15 20:26:24.0
Juki Corporation, a world-leading provider of automated assembly products and systems, announces that Gerry Padnos, Director of Technology, will present a paper titled "Improving Efficiency with Root Cause Failure Analysis" at the upcoming IPC APEX EXPO.
Industry News | 2012-09-10 10:44:36.0
Juki Automation Systems, will participate in the Package-on-Package (PoP) Design and Assembly Center during the annual SMTA International conference, scheduled to take place October 14-18, 2012 in Orlando, FL.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
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