Electronics Forum | Wed Oct 30 02:12:39 EDT 2019 | jags
yes and thanks for this feedback. we clean with degreaser ( strong) and flux is rosin with 10% in the paste (koki). we clean after second reflow . the gap time from bottom to topside completion is 10 hours. cleans with this time. my even after 20 h
Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon
| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a
ETA T Series Lead Free Reflow Oven If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Reflow Oven, Reflow Soldering, Reflow Soldering Oven, SMT
ETA Pyxis Series CBS Reflow Oven If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Reflow Oven, Reflow Soldering, Reflow Soldering Oven,
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NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
3D ICs With TSVs - Design Challenges And Requirements Heat Management in Printed Circuit Boards This report discusses the significance of heat management in the design of printed circuit boards (PCB).After an introduction into the basics of PCBs
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: With the EXOS 10/26, Ersa presents a convection reflow soldering system with 22 heating and four cooling zones as well as a vacuum chamber after the peak zone, with which the void rate can be reduced by 99
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even the most difficult surfaces. WS flux residue is corrosive and should be removed as soon as possible after reflow to avoid damage to your assembly. Maximum safe time before cleaning is product dependent. Wave Soldering A process of soldering
